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Intelligence is IN the Sensor: The New Frontier of MEMS
Presented by: Andrea Onetti, Executive Vice President, MEMS Sub-Group Analog, MEMS and Sensors Group – STMicroelectronics
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Heterogeneous Integration for MEMS and Sensor Packages
Presented by: Adrian Arcedera, Sr Vice President MEMS and Sensor Products – Amkor Technology, Inc.
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Executive Vice President, MEMS Sub-Group Analog, MEMS and Sensors Group – STMicroelectronics
Andrea Onetti is STMicroelectronics’ Executive Vice President, MEMS Sub-Group Vice President and has held this position since January 2022. Onetti joined STMicroelectronics’ R&D Lab in Castelletto, Italy, in 1990, as a designer of mixed-signal audio ICs. Later he moved into Product Management and Marketing for Consumer Audio and was promoted to General Manager of a Product Division. Onetti’s mandate was expanded to include ST’s Audio and Sound Business Unit in 2011 and the Analog and Audio Systems Division in 2014. In 2016, he was promoted to Head of ST’s MEMS Sensors Division, driving business and margin growth in MEMS sensors, product portfolio expansion and optimization, as well as ST MEMS ecosystem creation including strategic partnerships with key industry players including Qualcomm and Microsoft.
Onetti has several patents for analog circuit implementations in the Audio domain. Andrea Onetti was born in Pavia, Italy, in 1965, and graduated with a Degree in Microelectronics from University of Pavia.
STMicroelectronics took up the challenge to combine a Digital Signal Processor (DSP) suited to run AI algorithms and MEMS sensor on the same silicon. And it succeeded with the recent launch of the Intelligent Sensor Processing Unit – ISPU. It provides substantial benefits in power consumption, packaging, performance, and price. The proprietary ultra-low-power DSP can be programmed in C, familiar to many engineers. It also allows quantized AI sensors to support full- to single-bit-precision neural networks.
The Onlife Era acknowledges living with continuous assistance from connected technologies, enjoying natural, transparent interactions, and seamless transitions, with no discernible distinction between online and offline. With the ISPU, ST is enabling this era by helping to migrate intelligent processing into sensors that support the fabric of life.
At ST, we are 48,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An independent device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of the Internet of Things and 5G technology. ST is committed to becoming carbon neutral by 2027. Further information can be found at www.st.com
Sr Vice President MEMS and Sensor Products – Amkor Technology, Inc.
Adrian joined Amkor in 1997, and is currently Sr VP for MEMS and sensor products, responsible for the business and platform development for MEMS & sensors packages. He has served in various positions in product and business development and management of Amkor’s chip scale products, including leading the platform development for Amkor’s ChipArray®
package. Prior to joining Amkor, Adrian was a materials engineer for Motorola in the Philippines. He holds a degree in chemical engineering from the University of the Philippines.
Microelectromechanical systems (MEMS) technology and sensors enable a wide range of applications from the Internet of Things (IoT), 5G wireless technology, artificial intelligence (AI) to autonomous driving. While other basic building blocks like microcontrollers, connectivity and others have all benefited from using standard integrated circuit (IC) packaging platforms, a broad diversity of package types and form factors for almost every application and end market has been created for MEMS and sensors.
The evolution from a discrete single MEMS/sensor towards sensor fusion has created new opportunities and applications. Standard MEMS and sensor platforms have helped market proliferation by providing customizability on the inside and a standard form factor on the outside package. This ensures maximum compatibility during packaging assembly, final test and surface mount assembly processes without sacrificing device performance.
As the market continues to grow, and applications continue to become more complex, the need for heterogeneous integration (HI) becomes an essential part of the new standard MEMS and sensor package platforms. This webinar will explore the different solutions available from an outsourced assembly and test (OSAT) supplier and their advantages for MEMS and sensor products.
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