Jianmin Li photo

Jianmin Li

  • Amkor Technology China, Inc.
  • Packaging R&D Director
  • Biography

Jianmin joined Amkor in 2013, and is currently packaging R&D director in Amkor Assembly & Test (Shanghai) Co. Ltd, responsible for developing various package type including memory SCSP, flip chip package, SiP and optical sensor packages. He has more than 20 years of experience in assembly process engineering area. Prior to joining Amkor, Jianmin was an assembly process engineer in Intel and IBM. He holds a Master degree in Material Engineering from Fudan University.

  • Presentation
New Package Solutions for Automotive Optical Sensors

Advanced Driver Assistance Systems (ADAS) are designed to help the driving process and enhance car/road safety. Automotive optical sensors enable ADAS and the autonomous driving transition from SAE J3016 Level 2 towards Level 4/5, according to SAE International (formerly the Society of Automotive Engineers).

Current optical sensor chip designs require custom package solutions which have assembly packaging and test challenges. In addition, stringent reliability requirements increase the development time to select materials, run process evaluation, optimize process parameters and complete reliability verification for automotive applications.

New automotive optical package innovations extend Amkor’s broad package portfolio capabilities and expertise to benefit automotive customers. The solution to current automotive image sensor application challenges involves creating a package platform that utilizes an assembly open toolbox, adopts a new generation of wafer fabrication requirement, achieves faster development cycle time and manages cost efficiency.

This presentation will discuss a standard package platform to design alternative package solutions, overcome technical challenges and satisfy the Automotive Electronics Council’s AEC Q100 reliability requirements for automotive optical sensors.

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  • Company Profile

Amkor Technology China, Inc.

Amkor Technology, Inc. is the world’s largest US headquartered OSAT (outsourced semiconductor assembly and test). Since its founding in 1968, Amkor has pioneered the outsourcing of IC packaging and test services and is a strategic manufacturing partner for the world’s leading semiconductor companies, foundries, and electronics OEMs. Amkor provides turnkey services for the communication, automotive and industrial, computing, and consumer industries, including but not limited to smartphones, electric vehicles, data centers, artificial intelligence and wearables. Amkor’s operational base includes production facilities, product development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the United States. Learn more at https://amkor.com

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