Jianmin Li photo
MWS China 2022 Speaker

Jianmin Li

  • Amkor Assembly & Test (Shanghai) Co. Ltd.
  • R&D Director, Assembly Process Engineering
  • Biography

Jianmin joined Amkor in 2013, and is currently packaging RnD director in Amkor Assembly & Test (Shanghai) Co. Ltd, responsible for developing various package type including memory SCSP, flip chip package, SiP and optical sensor packages. He has more than 20 years of experience in assembly process engineering area. Prior to joining Amkor, Jianmin was an assembly process engineer in Intel and IBM. He holds a Master degree in Material Engineering from Fudan University.

  • Presentation
Extending the Optical Sensor Product Portfolio with Innovation in Package Solutions

As optical sensors become more integral in complex sensing applications, utilizing standard packaging solutions and customized designs become critical in decreasing the time to market. Proximity and ambient light sensors are widely adopted in smartphones. New features continue to be implemented on those sensors, such as under display sensing capability. New optical sensor types are also seen in smartphone and wearable devices, such as distance sensor, RGB color sensor, heart rate sensor, blood oxygen and blood pressure sensors. Market trends show these optical sensors require a different level of integration to save space, improve performance and provide multi-function integration. The package for receiver only function needs to evolve to multi-function sensors which combines transmitter and receiver into a single package. Light isolation between transmitter, and in some cases the lens, also needs to be integrated. Furthermore, the concept of heterogeneous integration is opening new possibilities to add processors with optical sensors. This presentation will explore the different packages available from an outsourced assembly and test (OSAT) supplier and their advantages for optical sensor products.

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  • Company Profile

Amkor Assembly & Test (Shanghai) Co. Ltd.

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