
Yuanli Sun
Yuanli Sun received her M.S. degree in Industrial Management from the Polytechnic of Turin (Italy) in July 2012. She joined SPEA during her last academic year as a semiconductor testing equipment application engineer. She rapidly achieved being responsible for application development projects for IC, Power and MEMs devices,technical expertise that involve data modeling and analysis, C/C++ program languages, also, she participated in the design of extremely accurate measurement modules that are widely used in MEMS wafer testing.
With such a strong and well prepared background, in 2014, Yuanli establishes a wholly owned subsidiary of SPEA in China, where she’s responsible in full for SPEA’s business development and after-sales service in China. Riding the wave of success, Yuanli establishes more offices in Suzhou, Shenzhen, and Chongqing to enhance the popularity and reputation of SPEA in China.
Today, as General Manager of SPEA China, her group has worked directly with SPEA’s customers to develop state-of-the-art technology for testing high volume Power Modules, MEMS test cell, wafer level tester high parallelism solutions.
MEMS Test Equipment Standardization: New Opportunities (especially) for OSATs
More than half of MEMS packaging today is done by OSATs, and OSATs’ market share is expected to continue growing in the next years. The same trend could follow in MEMS testing, which can represent between 30-90% of final component price, depending on the end application. Although, test equipment for MEMS is strongly application-dependent and scarcely reusable for different devices. This aspect has acted as a break for OSATs in expanding their MEMS testing business. The availability of standard testers and test handlers, based on a common structure and able to incorporate modular and interchangeable test units for different device families, is opening new scenarios for both OSATs and IDMs. We explored these new opportunities, focusing on the advantages – in terms of cost of test, performance and ROI – experienced by major OSATs that are opening this path to growth. Specific application case studies will be presented, dedicated to inertial, pressure, and magnetic sensor testing.

SPEA
Established in 1976, SPEA is a world leading company in the field of automatic test equipment for ICs, MEMS, sensors, electronic boards. SPEA serves the big semiconductor IDMs and OSATs with the most cost-effective and high-performance equipment to test automotive, SoCs, analog mixed-signal devices, MEMS sensors and actuators, power and discretes, identification devices, delivering highest measurement capabilities, lowest cost of test and fastest time-to-market. SPEA systems are designed to detect any possible defect in electronic products, so that they won’t fail on the field. High throughput, best detection capability, test techniques designed on the latest technologies requirements, complete configurability. For SPEA customers, testing is not an additional cost, but a tangible competitive advantage.
More MWS China 2022 Speakers

Jianmin Li
R&D Director, Assembly Process Engineering
Amkor Assembly & Test (Shanghai) Co. Ltd.

Dr. Yuan Zheng
Corporate Vice President Product and Technology, ICAPS
Applied Materials

Miaogong Huang
Technology Director
Autolink Information Technology Co.,Ltd.

Keith Nicholson
Global Head of Application Engineering Department
Bosch Sensortec GmbH

Marco Chen
Senior Sales Manager, Evatec China
Evatec

Dr. Bill Nie
Chairman
FATRI United Testing & Control (Quanzhou) Technologies Co., Ltd.

Dr. Mark Wang
CEO
GMEMS Technologies, Inc

Jase Chen
Senior Director
Goertek Microelectronics

Prof. Hong-Bin Yu
TBC
HUST

Dr. Jeffrey Wang
Director
Institute of Advanced Optics, CSGC

Lei Liu
Co-Founder
Insync

Michelle Bourke
Managing Director of Strategic Marketing
Lam Research

Dr. Kevin Song
CTO
Lochn Optics

Carl Zhang
VP
MEMSensing

Edith Beigné
Silicon Research Director | Reality Labs
Meta

Rob Devlin
Co-founder and CEO
Metalenz

Dr. Wei Zhao
Strategic Marketing Director
Onto Innovation

Tao Wu
Asst Professor
School of Information Science and Technology, ShanghaiTech University

Dr. Alex Gu
Chairman of MEMS World Summit Advisory Board
Dean of The School of Microelectronics Industry

Prof. Yuan Dong
Professor
School of Microelectronics, Shanghai University

Prof. Ting Hu
Professor
School of Microelectronics, Shanghai University

Dr. Lou Liang
Director
Shanghai Industrial μTechnology Research Institute (SITRI)

Jie Sun
Director
Yanfeng Electronic Technology

Dr. Teng Gao
SVP & CSO
Shanghai Industrial μTechnology Research Institute (SITRI)

Dr. Wei Wang
Director of Silicon Photonics
Shanghai Industrial μTechnology Research Institute (SITRI)

Dr. Songsong Zhang
Director
Shanghai Industrial μTechnology Research Institute (SITRI)

Xiaofan Wang
Vice Principal
Shanghai University

Prof. Zhen-Yu Wu
Professor
Shanghai Institute of Microsystem and Information Technology (SIMIT), Chinese Academy of Sciences, Shanghai

Haiying Duanmu
Deputy Secretary General of MIA / Director of VAIA special committee
Shanghai Multimedia Industry Association

Prof. Qi-Ze Zhong
Professor
Shanghai University

Dr. Cheng Guo
Founder and CEO
StepVR

Qiao Chen
GM/CTO
Suzhou Chipsens Technologies Co.,Ltd

Dr. Kunyun Yang
Co-Founder, CTO
Suzhou Leizhi Sensing Technology LLC and Gusu Laboratory of Materials

Dr. Guowei Cao
Engineer
United Microelectronics Center (CUMEC)

Dr. Tao Wang
Asst Professor
University of Electronic Science and Technology of China (UESTC), National Exemplary School of Microelectronics

Dr. Tao Wang
Asst Professor
University of Electronic Science and Technology of China (UESTC), National Exemplary School of Microelectronics

Jovin Li
Marketing Director
Xiamen Sky Semiconductor Technology Co. Ltd

Andrea Rusconi
Co-Founder & CTO
Usound

Dimitrios Damianos
Senior Technology & Market Analyst
Yole Intelligence part of Yole Group

Prof. Hanming Wu
Academician / Dean
Chinese Academy of Engineering / The School of Micro-nano-Electronics, Zhejiang University