Our 2023 Events
13-14 June 2023 | MEMS World Summit, EU
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1 Dec 2023 | MEMS World Summit, China
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Register
Become a member or register for specific events below.
MWS Membership
For OSATS | Foundries | IC Design Houses | End Users
Enjoy the following benefits with our annual membership
VIP Access
- 1 Membership package per company for a whole year
- 1 Free VIP pass to all events for C/VP/GM/Director level executive from Technology, R&D, Manufacturing, Engineering, Operations & Purchasing departments.
Huge Discounts
All additional event passes will be registered at the lower member rate.
An example of membership cost savings when registering an ISES China event pass:
- Member rate per event:
– MWS EU $1,050
– MWS China $800 - Non-Member rate per event:
– MWS EU $2,050
– MWS China $1,800
Exclusive Benefits
- Access to all 250+ shareable presentation slides from MWS events during your annual subscription period (this includes events you can’t make it to attend in person)
- First refusal to available speaker slots (subject to Advisory Board approval)
- Full year’s Membership company logo branding in association with MWS on online and offline materials
- Discounted member rates on MWS sponsorship packages
Member Joining Fee: $3,000
Plus 7.5% service charge
For Equipment | Materials | EDA | Software Suppliers
Please contact us for supplier sponsorship opportunities via our ISES Sponsorship Form
Join MWS China/EU (2023)
Physical Event Pass
For OSATS | Foundries | IC Design Houses | End Users Only
- 1 VIP Pass to MWS
- Full Hospitality Service Included (Accommodation is not included)
- The VIP Pass registration fee includes admission to all conference sessions, program book, online access to abstracts, lunches, coffee breaks, and admissions to the cocktail reception and the Gala Dinner.
- Company Branding Service Included in Association
- Full Access to all Networking / Presentations / and Entertainment
- Company Logo Associated with MWS
MWS China 2023
Members: $800 per person
Non-Members: $1,800 per person
Plus 7.5% service charge
Virtual Event Pass
For OSATS | Foundries | IC Design Houses | End Users Only
- Full Access to Virtual Live Event (MWS)
- On Demand Access with English subtitles for 7 Working Days
- Company Information and Attendee Included in Participation List
- Access to All Shareable Authorised PPTs
- Additional Passes Available at 20% Discount
MWS EU 2023
Investment: $500
Plus 7.5% service charge
Supplier Networker Sponsor
For Equipment | Materials | EDA | Software Suppliers
To enquire about sponsorship opportunities, please visit our ISES sponsorship contact form
Alex Gu
Coralie Gallis graduated as a PhD in Materials Sciences from Paris University and has an engineering degree in Physic-Chemistry. Coralie has worked for 20 years in the semiconductor field, holding various positions in different companies from software designer, Intelligent Specialist, Business Development and Strategic Partnerships. During her career, she developed the business for various domains such as BioMedical electronics, wearable electronics for healthcare, sport, wellness and Food industry. Since 2016, she is based in Silicon Valley, California and manages the Strategic Industrial Partnerships for the North American Market for CEAtech, a French technology research center.
Michelle M. Bourke received a B.Sc. degree in Optoelectronics and Laser Engineering from Heriot-Watt University, Edinburgh, Scotland, U.K., in 1993. Subsequently she joined the Defence Evaluation and Research Agency (DERA), where she worked on advanced processing methods for GaAs/AlGaAs optoelectronic devices. In 1997 Michelle moved to the semiconductor capital equipment industry as an etch process engineer. In 1999 she moved into Product Marketing where she has continued to develop her career. Today Michelle is with Lam Research Corporation as the Senior Strategic Marketing Director in the Customer Support Business Group.
Dr. Mary Ann Maher received her Ph.D. from Caltech in 1989 in the area of semiconductor device modeling. At Tanner Research she began the simulation and modeling group and launched Tanner’s T-Spice analog circuit simulator product. As Director of Advanced Products, she brought to market Tanner’s MEMS Pro microsystem and MCM Pro multi-chip module and packaging design tool. Moving to MEMSCAP, she became the company’s CTO and the General Manager and Executive Vice President of the Design Automation Business Unit. In 2004, she started SoftMEMS, LLC, the maker of the popular microsystems design tools – MEMS Pro and MEMS Xplorer, where she serves as CEO.
