MWS EU 2021 Speaker
Dr. Gihun Ryu
Gihun Ryu received his Dr. Ing. in Material Science and engineering from Tokyo Institute of Technology, Tokyo, Japan in 2012. Before receiving PhD Degree, he worked as a Research Engineer in S&S Tech, South Korea (2005), for the development of advanced Mask Blank and Photo Mask using ULVAC In-line type Sputter and commercial dry/wet etching systems for KrF, ArF, EUV as well as, LCD based Applications. After obtaining his PhD degree in 2012, he worked as post-doc scientist in Max-Plank-Institute for Solid State Research from 2012 to 2016 in Stuttgart and Max-Plank-Institute for Chemical Physics of Solids from 2016 to 2019 in Dresden, Germany where he studied the crystal growth mechanism, design of new functional inorganic compounds, analysis of physics properties for over 1000 new functional inorganic compounds. Dr. Ryu joined ULVAC in 2020 and is currently working as a “senior application engineer” for piezoelectric MEMS application and related MEMS projects in Europe. In particular, Dr. Ryu is also interesting in designing new piezoelectric materials/stacking structure, advanced deposition technology of piezoelectric based thin films such as PZT, Sc doped AlN, lead-free piezoelectric compounds as well as new etching technology using Ulvac Sputtering and Dry etching tools.
ULVAC’s MEMS Solutions Based on Piezoelectric PZT and Sc-AlN Thin Films
Piezoelectric thin films have been integrated with advanced silicon-based microfabrication methods in the formation of both sensors and actuators that are called “MEMs”. Currently, (I) Ultrasound, (ii) Inkjet-printheads and (iii) Micro-mirror applications – based on the MEMs actuators, are driving the market with a huge forecast for 2026. New opportunities mentioned above could be the trigger for rapid growth of the MEMS Actuator market. For last few decades, most of commercialized piezo-actuators have been based on bulk piezoelectric ceramics. However, bulk piezoelectric ceramic faces difficulties due to the limitation of integration with MEMs, thickness demands as well as power consumption requirements.
ULVAC will introduce the newly developed mass production deposition and etching solutions that are applicable to CMOS compatible process with the threshold of < 500oC that address many of the previous bulk material limitation as well as the etching performance of Sc doped AlN that are currently leading this MEMS market area.
ULVAC GmbH
Western Operations consists of
· ULVAC GmbH which was established in 1987 as the European subsidiary of ULVAC, Inc. headquartered in Munich, Germany. ULVAC’s solutions diversely incorporate equipment, materials, and services for Semiconductors, MEMS, Flat Panel Displays, Electronic Components, PCB, TFB, and other Vacuum Equipment for the European Markets.
In 2019 ULVAC opened a PZT full stack Deposition Foundry Service located in Europe. We are taking orders for customer demo wafers. 71 words.
· ULVAC Technologies, Inc. (ULVAC) was established in 1992 as the U.S. subsidiary of ULVAC, Inc. Headquartered in Methuen, Massachusetts. ULVAC’s solutions diversely incorporate equipment, materials, analysis, and services for flat panel displays, electronic components, semiconductors, MEMS and general-industry equipment. In addition, the Methuen facility is equipped with a Class 10 cleanroom for process development, customer demonstration and manufacturing of the ENVIRO solvent-free dry photo resist stripper and compound semiconductor materials etch systems. Other in-house services include foundry etch (for deep oxide and compound semiconductor materials), thermal processing, materials characterization, and vacuum pump/leak detector repair.
ULVAC GmbH
Klausnerring 4
85551 Kirchheim b. München
Germany
Fon: +49 – 89 – 96 09 09 – 0
Fax: +49 – 89 – 96 09 09 – 96
Email:
http://www.ulvac.eu
ULVAC Product Information
For MEMS application ULVAC has developed systems dedicated to MEMS sensors, actuators, switches, lab-on-chip and micromirror manufacturing. This equipment range includes sputtering and etching for piezo electric materials like PZT, AlN and ScAlN, glass and metal etching, thick resist ashing, resist and polymer removal within trench structures, and others.
Piezoelectric materials can be used to further miniaturize a range of devices, including inertial sensors, tuneable RF devices, inkjet print heads, micromirrors, microphones, autofocus lenses and others. The integration of thin film deposition directly on CMOS-processed wafers is key for highly-integrated devices. ULVAC has developed high-volume processing sputtering method that allows sub 500°C processing temperatures, is configured to pole the piezoelectric crystals during the deposition process and is compatible with other CMOS processes.
Alex Gu
Coralie Gallis graduated as a PhD in Materials Sciences from Paris University and has an engineering degree in Physic-Chemistry. Coralie has worked for 20 years in the semiconductor field, holding various positions in different companies from software designer, Intelligent Specialist, Business Development and Strategic Partnerships. During her career, she developed the business for various domains such as BioMedical electronics, wearable electronics for healthcare, sport, wellness and Food industry. Since 2016, she is based in Silicon Valley, California and manages the Strategic Industrial Partnerships for the North American Market for CEAtech, a French technology research center.
Michelle M. Bourke received a B.Sc. degree in Optoelectronics and Laser Engineering from Heriot-Watt University, Edinburgh, Scotland, U.K., in 1993. Subsequently she joined the Defence Evaluation and Research Agency (DERA), where she worked on advanced processing methods for GaAs/AlGaAs optoelectronic devices. In 1997 Michelle moved to the semiconductor capital equipment industry as an etch process engineer. In 1999 she moved into Product Marketing where she has continued to develop her career. Today Michelle is with Lam Research Corporation as the Senior Strategic Marketing Director in the Customer Support Business Group.
Dr. Mary Ann Maher received her Ph.D. from Caltech in 1989 in the area of semiconductor device modeling. At Tanner Research she began the simulation and modeling group and launched Tanner’s T-Spice analog circuit simulator product. As Director of Advanced Products, she brought to market Tanner’s MEMS Pro microsystem and MCM Pro multi-chip module and packaging design tool. Moving to MEMSCAP, she became the company’s CTO and the General Manager and Executive Vice President of the Design Automation Business Unit. In 2004, she started SoftMEMS, LLC, the maker of the popular microsystems design tools – MEMS Pro and MEMS Xplorer, where she serves as CEO.
