MWS EU 2021 Speaker

Dr. Walter Weigel

  • Huawei
  • VP & CSO, European Research Institute
  • Biography

Dr. Walter Weigel graduated from the Technische Universität München, Germany, with the Diplom-Degree in electrical engineering in 1984 and with the Ph. D. degree (thesis about pattern recognition applied to speech recognition) in 1990. From 1984 to 1991 he was assistant at the Lehrstuhl für Datenverarbeitung (Institute for Data Processing) at the Technische Universität München.

Dr. Weigel is since 1st April 2015 VP and CSO of the European Research Institute of Huawei in Leuven, Belgium.

He was from September 2006 to July 2011 the Director General of the European Telecommunication Standards Institute ETSI. Between February 1991 and February 2015 he held several positions within Siemens AG, including VP of External Cooperations and Head of Standardization in Corporate Technology, VP of the Research & Concepts-department of the Mobile Networks business unit as well as Head of the business segment Video Processing for the semiconductor business unit (today Infineon).

He is a member of the Innovationsdialog of the German Government, of the BDVA (Big Data Value Association) Board of Directors, of the Senate of Acatech (German academy of technical sciences), of the Board of 5GAA (5G Automotive Association), of the IEEE-SA Board of Governors, of the Digital Manufacturing Executive Council of Digital Europe and of the Advisory Committee of CTIF Global Capsule (CGC) of Aarhus University. He is also lecturer and honorary professor at Technische Universität München.

  • Presentation

MEMS Packaging & Integration – General Trends and Requirements for Advanced Applications

Novel information and communications technologies rely on state of the art hardware products. This requires a strong ownership in product optimization, advanced system architectures, overall integration and cooperation with key development owners in industry. MEMS technologies are ubiquitous in modern products and customer solutions, requiring ever increasing complexity in device processing, development and integration with other sub-blocks and technologies. While advanced CMOS and chip development has had a very mature development, MEMS will need to follow the same path in the long-run.

The talk will introduce the advances in MEMS technologies, the general process requirements to achieve state of the art solutions, and most importantly, the requirements in integration with other hardware development technologies.

Huawei logo
  • Company Profile


Huawei is a leading global information and communications technology (ICT) solutions provider. Through our dedication to customer-centric innovation and strong partnerships, we have established end-to-end advantages in telecom networks, devices and cloud computing. We are committed to creating maximum value for telecom operators, enterprises and consumers by providing competitive solutions and services. Our products and solutions have been deployed in over 170 countries, serving more than one third of the world’s population. Huawei has over 180,000 employees, approximately 80,000 of which are engaged in Research & development. Huawei operates a global network of 12 regional headquarters, 14 R&D Centers, 36 Innovation Centers jointly operated with customers, and 45 Training Centers. Huawei is leading the way by rethinking the future. From devices to telecom infrastructure to cloud computing and convergence solutions, we are rethinking every link in the chain with ICT based innovation to deliver a better future…faster.

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