MWS EU 2021 Speaker
Stefan joined Amkor in 2019 and currently serves as a Director for MEMS and Sensor Products. He manages assembly and test services for large volume automotive and consumer MEMS sensors for European customers. Stefan has 15 years of experience in the semiconductor industry and held positions at Infineon and Huawei in Germany, primarily in the field of RF devices and modules prior to joining Amkor. He has been issued 15 patents and holds a MSc in Applied Physics as well as a PhD in Microsystem Engineering from the University of Freiburg, Germany.
Evolution of MEMS and Sensor Packaging
Microelectromechanical systems (MEMS) technology and sensors help to enable a wide variety of applications for Internet of Things (IoT), 5G communications, artificial intelligence (AI) and autonomous driving. The use of standard integrated circuit (IC) packaging platforms has benefited microcontrollers, connectivity circuitry and other basic building blocks in these applications. In contrast, for MEMS sensors, a broad diversity of package types and form factors for almost every application and end market has been created.
As the MEMS market and sensor applications continue to grow, package assembly and test standardization will be needed to offer cost competitive solutions without sacrificing performance. However, unique wafer fabrication techniques produce the silicon-based MEMS sensors and actuators that respond to or interact with external or environmental stimuli. This uniqueness creates different assembly packaging and test challenges – such as controlling package stresses while allowing specific environmental stimuli to reach the device.
During this presentation, the evolution from discrete, single-chip MEMS devices towards highly integrated sensor module packages will be described. In addition, a roadmap outlook for MEMS outsourced assembly and test (OSAT) services and their advantages for MEMS and sensor products and suppliers will be presented.
Amkor Technology, Inc.
You may know us for high-quality semiconductor packaging and test services. But do you know what inspires us to do what we do? An unswerving commitment to customer service, engineering expertise, and high volume manufacturing excellence. Helping solve the complex technological challenges facing the industry is what continually motivates us. We want our customers to focus their resources on semiconductor design and wafer fabrication while trusting us to be their reliable packaging technology innovator and test partner.
Amkor’s operational base includes production facilities, product development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the USA. As the original pioneers of the OSAT industry, Amkor Technology has helped define and advance the technology manufacturing landscape. Since 1968, we’ve delivered innovative packaging solutions with the service and capacity global customers rely on. We’re proud of what we’ve done and can’t wait to show you what’s next.