Vinod Kumar Ramu

Terms & Conditions

Terms & Conditions

Scope of Agreement

These are the conditions of the contract between you, the Client (“You” and “your”) and MEMS World Summit (“MWS”, “we”, “us” and “our”) governing your use of our services, including event attendance as set out in your booking form. This agreement constitutes the entire agreement between MWS and you. All prior agreements understandings and negotiations and representations (save for fraudulent misrepresentation) whether oral or in writing are cancelled in their entirety. The terms of any other electronic communications will not form part of this agreement.

Our Commitment To You

We will provide you with a planned schedule prior to the Event. Please note that this schedule may be altered where necessary by us.
We reserve the right to determine the theme, scope and content of seminars and presentations to be held during the Event and to vary the programme and / or its contents as deemed necessary.
Should the event be cancelled or the location be changed for reasons or circumstances beyond our control we reserve the right to reschedule the Event, including changing the location, and / or withdrawing delegates attendance upon written notice to you. If your attendance is withdrawn by us you will receive a full refund of your registration fee.

Delegates

Only named or pre-agreed delegates may attend the Event. Non–appearance of any of the Delegates will not affect your obligation to pay in accordance with the terms set out below (5). No persons other than those officially registered or agreed with us may attend any part of the Event.
Delegates must adhere to the deadlines set out by the Operations Manager. Deadlines will be communicated once we have received your delegate contract confirmation. This includes returning your catalogue entry form, delegate photograph and your prioritised meeting request choices.
Delegates must attend all prescheduled Event meetings and the seminar programme.
Delegates are responsible for their own insurance (including, but not limited to, travel insurance, personal effects and personal insurance), vaccinations and visas (where applicable).

Flights / Hotel – Airport Transfers / Accommodation

Delegates are responsible for their own flight, transfer arrangements and accommodation and the costs associated with them.

Payment

The total fees specified on the Agreement are subject to an additional service charge of 7.5% (“Service Charge”) applied to cover administration costs, and are exclusive of VAT and any other applicable sales tax which shall be payable in addition.
Payment must be received in full within 28 days from the date of this agreement.
The applicable VAT rate will be charged in addition to the Total Cost.
Contracts received within 28 days of the start of the event must be paid by return.

Cancellation

Cancellations received more than twelve weeks prior to the Event commencement date will be entitled to a full refund of the registration fee paid.
If you cancel your registration less than twelve weeks before the Event commencement date you will incur a charge of £1,500 (less any registration fee, as specified on this registration form, that you may have already paid which will not be refunded).
Cancellation fees can be avoided by providing replacement delegates from your organisation. You will be liable for any additional cost incurred as a result of supplying replacement delegates. We reserve the right to refuse replacement delegates.
All cancellations must be received in writing and agreed by us, and full cancellation fees must be paid within 14 days.

General

You the delegate, your executive/s or your agents may not transfer or assign any of the rights or obligations of this Agreement (in whole or part) without our prior consent. Any attempt to resell, assign or transfer rights without our consent will entitle us to cancel the contract without liability to you.
MWS is subject to the UK Data Protection Act 1998 and is registered in the UK with the Information Commissioner t o process your personal information. Our primary goal in collecting personal information from you is to give you an enjoyable customised experience whilst allowing us to provide services and features that most likely meet your needs. We collect certain personal information from you, which you give to us when using our Sites and/or registering or subscribing for our products and services. We also collect certain personal data from other group companies to whom you have given information through their websites. If you do not want us to continue using this information please notify us at enquiries[a]ioctr.com. Any personal information supplied to MWS as part of this registration process and/or any other interaction with MWS will be collected, stored and used by MWS, its subsidiaries, related companies or affiliates in accordance with the MWS Privacy Policy. Please email enquiries[a]ioctr.com for a copy of the MWS Privacy Policy.
This agreement is governed by and will be construed in accordance with English law and each party irrevocably agrees that the courts of England will have the non-exclusive jurisdiction to deal with any disputes arising out of or in connection with this agreement.
The working language of the Event is English. Delegates requiring an interpretation service must make their own arrangements at their own expense.

Mike Rosa

Chief Marketing Officer (CMO), MtM Equipment Grp, Applied Materials

Biography

Mike currently leads the Strategic & Technical Marketing group within the ≤200mm/300mm MtM equipment business unit at Applied Materials. As CMO, he and his team are responsible for defining strategic and technical product marketing and marketing communications for the group, including identifying key device level technology inflections and translating those into roadmap requirements for the continued development of ≤200mm & 300mm semiconductor equipment and processes in support of MtM device technologies. Mike also supports the group in a strategic business development capacity, focusing on M&A and inorganic revenue generation.

With over 20 years of technology focused product and business development experience Mike brings to his role significant MtM domain knowledge and technology commercialization expertise. Prior to joining Applied Materials Mike held various contributor level and senior leadership positions within the United States and Australia. His technical qualifications include B.Eng. (Hons) in Microelectronic engineering, a Ph.D. in MEMS / Microsystems design and fabrication and an MBA with dual majors in Marketing and Business Strategy. Mike has authored over 40 journal and conference publications and holds over 28 U.S. patents concerning various applications of MtM technology.

Presentation

Panel Moderator

Author: Hong Wan (left), Presenter: Peng Qiu (right)

Author: Hong Wan

VtranTech, Founder and CEO

Biography

Dr. Hong Wan is the founder and CEO of VtranTech Corp. Dr. Wan has more than 20 years experiences in R&D, manufacturing and applications of sensor industry in USA and China, related to the fields of industrial, automotive and consumer electronics. Prior to establish VtrantTech, she was a cofounder and CTO of QST, also served as a senior director of Advanced Product Development in mCube, a technical manager in Eaton Innovation Center and worked more than 15 years at Honeywell with various roles. Dr. Wan has more than 70 technical publications and patents. Dr. Wan received her Ph.D and BS in Physics from Peking University, China.

万虹，博士，微传智能科技（常州）有限公司董事长兼总经理。江苏中科院智能科学技术应用研究院研发中心主任。

1988年获得北京大学物理学博士学位，1989年到美国从事科研工作，先后在加州大学（UCSD）和特拉华大学做博士后。1995年至2009年在美国Honeywell公司任职，历任高级工程师、总工程师和资深技术经理等职务。2009-2012年在美国mCube公司任资深新技术产品总监。万虹博士具有二十多年工业界产品研发、制造和应用经验，涉及工业、汽车和消费电子等领域,拥有60多个国际专利和研发了全球首发的单芯片多轴AMR传感器和单芯片AMR-CMOS集成传感器，是世界级知名磁传感器专家和MEMS运动传感器融合与应用专家。

2012年回国创业，是上海矽睿科技公司的核心创始人.历任副总经理，首席技术官。

2017年1月 – 至今，创建微传智能科技（常州）有限公司并担任总经理/董事长。公司以磁与MEMS运动传感器为核心，为新能源汽车，物联网和工业应用研发、生产及销售高附加值的智能传感器产品。

Presenter: Peng Qiu

VtranTech, Director of Operations

Biography

Master of Shanghai Jiaotong University，Nearly 20 years of semiconductor experience

Presentation

Topic: New Opportunities of Magnetic Sensor in Automotive and Other Relevant Fields

With IoT, smart city, and smart vehicle rolled out globally, many new applications for magnetic sensors present great opportunities and also enormous challenges. The magnetic sensors have been utilized extensively in automotive industry. The presentation will focus in the areas of new energy vehicle, autonomies driving, parking and power charge stations. Detailed applications, market data, strength and weakness of each magnetic sensor technology and their manufactory methods will be revealed, and evolution map and trends will be discussed.

Lucy Huang / 黄向向

Hanking Electronics, Chief Executive Officer / 罕王微电子（辽宁）有限公司, CEO总裁

Biography

Lucy Huang is the President / CEO of Hanking Electronics（Liaoning） Ltd. Located in Shenyang, China, Hanking opened the first 200mm IDM MEMS fab offering 3dof and 6dof MEMS IMU, pressure and flow sensor products and MEMS foundry services. She has over 25 years of various MEMS sensor design and fabrication experience. Prior to HKE she worked at Delphi and Delco Electronics for 10 years in the area of MEMS and integrated circuits. She publishes over 15 technical papers, has 20 patents and has a M.S. in Electrical Engineering and Apply Physics in the area of MEMS from Case Western Reserve University.

黄向向是罕王微电子（辽宁）有限公司的总裁兼首席执行官。位于中国沈阳，罕王微电子成立了第一家200mm IDM MEMS工厂，提供3dof和6dof MEMS IMU、压力和流量传感器产品以及MEMS代工服务。她拥有超过25年的各种MEMS传感器设计和制造经验。在罕王微电子工作之前，她在Delphi和Delco电子公司工作了10年，在MEMS和集成电路领域工作了10年。她发表了超过15篇技术论文，拥有20项专利，拥有电气工

Presentation

Topic : Industrial MEMS Technology Trends / 主题：工业MEMS技术趋势

The Industrial Internet of Things IIoT, encompasses a number of new technology features centered around MEMS technology for lower power, energy harvesting and new sensing nodes. In the past few years, the market leading MEMS companies and technologies have shifted from piezoresistive to capacitive/electrostatic sensors and now to piezoelectric sensors and actuators. Piezoelectric RF filters are now out selling capacitive inertial sensors in terms of sales units and revenue. In the realm of piezoelectrics are seeing a shift from AlN to AlScN with ever increasing percentages of Sc and at the same time a push to eliminate lead (Pb) used in PZT actuators. For many industrial applications, higher temperatures, higher pressures and corrosive fluids are encountered. This paper will discuss how the industrial market leads to its own unique MEMS materials and MEMS packaging designs. MEMS wafer fabs have the ability to manufacture these new devices with exotic materials that is not allowed in a traditional CMOS wafer foundry. It is of paramount importance that a MEMS foundry partner have the material and process flexibility to match these new technology and material trends.

摘要：工业物联网IIoT包含了一系列以MEMS技术为中心的低功耗、能量收集和新的传感节点的新技术特征。在过去的几年里，市场领先的MEMS公司和技术已经从压阻式转变为电容式/静电式传感器，现在转向了压电式传感器和执行器。就销售单位和收入而言，压电式射频滤波器目前的销量已超过电容式惯性传感器。在压电领域，随着Sc含量的不断增加，AlN向AlScN转变，同时PZT驱动器中所使用的铅（Pb）也在逐渐减少。在许多工业应用中，会遇到高温、高压和腐蚀性流体。本文将讨论工业市场如何形成自己独特的MEMS材料和MEMS封装设计。MEMS晶圆厂有能力用传统CMOS晶圆铸造厂不允许的外来材料制造这些新器件。至关重要的是，MEMS铸造合作伙伴必须具备与这些新技术和材料趋势相匹配的材料和工艺灵活性。

Alex Gu

SITRI, Senior Vice President

Biography

Dr. Yuandong (Alex) Gu is currently a Senior Vice President of the Shanghai Industrial uTechnology Research Institute (SITRI), with overall responsibility for the Institute’s Technology and Products. Before SITRI, Dr. Gu was the Deputy Executive Director of the Institute of Microelectronics (IME), Singapore, overseeing strategic R&D programs including Advanced Optics, Sensor Actuators and Microsystems, and Miniaturized Medical Devices. His work bridges sensor design, microfabrication, sensor/ASIC integration, and WLP/CSWLP/SIP packaging; notably in piezoelectric AlN acoustic sensors, 4G/5G RF MEMS filter, and monolithic ultrasound sensor/ASIC integration. Dr. Gu was the Project Manager of one of DARPA featured projects in 2013; the recipient of the 2014 Prestigious Engineering Achievement Award by Institution of Engineers Singapore; and the recipient of 2016 TALENT award by A-STAR. Dr. Gu is the author/coauthor of 50 peer-reviewed journal papers; 90 top conference proceedings; and 20 granted patents. Dr. Gu received his M.E.E (2001) in Electrical Engineering and Ph.D. in Pharmaceutics (2003), both from the University of Minnesota, Twin Cities. Dr. Gu served as the SEMI–SEA MEMS Session Chair for two consecutive years in 2015 and 2016.

古元冬上海大学微电子学院院长；上海微技术工业研究院高级副总经理（产品和技术）

古元冬博士现任上海大学微电子学院院长，上海微技术工业研究院高级副总经理(产品和技术)。博士毕业于美国明尼苏达大学（PhD, 2003)。拥有 24项美国授权专利，在国际著名学术期刊及专业顶级会议发表论文140 余篇。目前致力于“超越摩尔”领域的研究。归国前，任新加坡微电子研究院（IME）执行副院长（2013-2018）。在此之前，于美国霍尼韦尔公司任高级及首席科学家和研发计划负责人(2002-2013)。

Winfred Chen / 陈苑锋

Chief Hardware Architect of AIoT, Home Service Robot, Intelligent Innovation Centre, Midea Group

Biography

Chen Yuanfeng graduated from Fudan University in 2006 with a Ph.D. in Microelectronics.
From 2006 to 2013, he worked for Samsung Semiconductor in South Korea and was involved in the design of several mobile CPU chips, including the world’s first large and small nuclear concept of mobile phone CPU. Before leaving office, he was the head of Samsung’s Greater China mobile phone chip FAE and provided technical services to four mobile phone companies in China Cool Union.
In May 2013, he returned to China to join Huawei Terminal Architecture Design Department, participated in the planning and research and development of Heath’s domestic chip Kirin930/950/970/980, and landed as a mobile phone product. During the terminal period, participated in the development of Heath’s first generation of independent ISPs, successful commercial. Later led Huawei’s mobile phone sensor subsysystor research and development team to overcome various sensors under the small size of commercial technology difficulties and innovations.
In August 2017, he joined OPPO as chief chip planner, leading OPPO’s chip planning, and also served as chip platform manager for OPPO R15 mobile phones, leading the R15 product team to a successful launch.
After joining Alibaba in April 2018 and participating in the acquisition of Zhongtian micro, IoT Hardware Lab was established as the chief hardware architect, groping out the hardware innovation model in the software company, launching Alibaba Cloud’s first innovative gateway and forming Ali Eco-Play.
In September 2020, he joined the Intelligent Innovation Center of the United States, responsible for the direction of home service robots.
Personal areas of expertise include: mobile phones, tablets, wearable devices and robot direction of professional system design, integrated circuit design optimization and selection has rich experience and solid foundation, with sensors, indoor and outdoor positioning navigation and computer vision processing basic theory and system optimization program experience, in the Internet of Things smart home, smart buildings, smart park, smart agriculture, smart industry, smart city has accumulated a lot of experience.
At present, in addition to his own work, he is also a special expert lecturer of Shanghai Pudong Smart Lighting Federation, an industrial planning consultant of Zhejiang Huzhou Municipal Government Integrated Circuit Industrial Park, and a special consultant of Pangu Venture Fund.

陈苑锋，2006年毕业于复旦大学微电子学专业，获理学博士学位。
2006年到2013年在韩国三星半导体就职，参与设计了多款手机CPU芯片，其中包括全球第一款大小核理念的手机CPU。离职前为三星大中华区手机芯片FAE负责人，为中华酷联四家手机公司提供技术服务。
2013年5月回国，加入华为终端架构设计部，参与了海思国产芯片Kirin930/950/970/980的规划和研发，并成攻落地为手机产品。在终端期间，参与了海思第一代自主ISP的研发，成功商用。后期带领华为手机传感器子系统的研发团队攻克小尺寸手机下的各种传感器商用技术难点和创新。
2017年8月以首席芯片规划师身份入职OPPO，主导OPPO的芯片规划，同时兼任OPPO R15手机的芯片平台经理，带领R15产品团队顺利落地上市。
2018年4月加入阿里巴巴，参与收购中天微后，建立了IoT硬件实验室，任首席硬件架构师，摸索出软件公司里的硬件创新模式，推出阿里云首个创新性网关，形成阿里生态打法。
2020年9月加入美的智能创新中心，负责家用服务机器人方向。
个人擅长的领域包含：手机、平板、穿戴式设备和机器人方向的专业系统设计；对集成电路的设计优化及选型具有丰富经验和坚实基础；具备传感器、室内外定位导航和计算机视觉处理的基础理论及拥有系统优化方案的丰富经验；在物联网的智慧家居、智慧楼宇、智慧园区、智慧农业、智慧工业、智慧城市积累了大量的经验。
当前除本职工作外，兼任上海浦东智慧照明联合会特聘专家讲师、浙江湖州市政府集成电路产业园产业规划顾问、盘古创业基金特聘顾问。

Presentation

Topic : Sensor Applications in the Internet of Things / 物联网中的传感器应用

Starting with the prospect and development trend of IoT, the important role of sensors in IoT is explained through practical cases, and the demand for sensors is further elaborated.

从IoT的前景和发展趋势入手，通过实际案例说明传感器对IoT的重要作用，并且进一步提出对传感器的需求。

Ellen Wang / 王晓红

IME Tsinghua Univeristy, Professor of Microelectroincs and Nonoelectronics / 清华大学微纳电子系，长聘教授，博士生导师

Biography

Xiaohong(Ellen) Wang is full professor in Department of Microelectronics and Nanoelectronics, Tsinghua University, China, guest professor in ETH Zürich, Switzerland. She received her Ph.D. from Tsinghua University in Mechanical Engineering. As a visiting scholar, she did the research on micro SOFC in Stanford University from Nov. 2005 to Oct. 2006.She also had several months’ research experience in HKUST and UCLA in 2001 and 2007, respectively.

Her research now is on the fields of MEMS/NEMS design and integration technologies, in particular on Power-MEMS, like micro fuel cells, micro supercapacitors, silicon-based lithium batteries, and biological micro generators etc. She was the General Co-Chair of IEEE-MEMS2016held in Shanghai, and has served several international conferences as TPC/ETPC member, like IEEE-IEDM, IEEE-MEMS, Transducers, Power MEMS etc. She is an Associate Editor of IEEE/ASME JMEMS and PNG Microsystems & Nanoengineering, Editorial Advisory Board member of JMM.

王晓红

长聘教授，博士生导师。1998年清华大学精密仪器与机械学系获博士学位。2005-2006年在美国斯坦福大学访问研究，2006年底至2007年春在美国UCLA任副研究员，2019年3-7月任瑞士联邦理工（苏黎世）学院客座教授。

主要从事MEMS及其集成技术研究，获得多项NSFC重点、国际合作和面上基金项目，以及国家973和863课题等。获美国专利和中国发明专利授权30多项，发表高水平学术论文百余篇。担任多个重点国际会议的TPC成员，如IEEE-IEDM、IEEE-MEMS、Transducers、IEEE Sensors、Power MEMS等，曾任IEEE-MEMS2016大会主席。目前是IEEE/ASME JMEMS和PNG Microsyst. & Nanoeng.杂志副主编，及JMM杂志顾问委员会委员。

研究方向：面向可穿戴与人工智能的自供能微系统/微能源系统（PowerMEMS），包括，系统设计与集成技术，微型超级电容与电池，能量收集器及其管理电路，微型传感器等。

Presentation

Topic: Micro supercapacitors at high-frequency based on nano materials and fabrications? / 基于纳米材料和制造的高频微超级电容器可否超越电解电容？

The rapid development of portable and wearable electronics has greatly increased the demand for energy storage devices with similar physical properties and integration capability.

With the advantages of high charge/discharge rate, long cycle life and high-energy efficiency, supercapacitors can bridge the gap between traditional capacitors and batteries, and are of the same importance as rechargeable batteries to energy storage systems. This speech will introduce the design of high-aspect-ratio 3D micro supercapacitors (MSCs). In particular, a novel MSC at high-frequency based on nano materials and fabrications, and a low-frequency filter circuit with MSC will be presented.

随着摩尔定律的发展，CMOS电路和MEMS器件体积在不断缩小，相对而言电容器在电路中则占据越来越大的空间。基于微加工技术的微型超级电容器具有远高于电解电容器的电容密度，以及片上成型和集成的潜力，但却由于电容值会随频率发生剧烈衰减而难以在交流下工作。本报告提出了一种基于低维材料的设计理念，使得超越电解电容的高频片上超级电容器的实现成为可能。

John Phair

Pyreos, CTO

Biography

Dr. John W. Phair, CTO, leads the development team at Pyreos Ltd, a company which develops unique thin-film pyroelectric detectors for sensing in the mid-infrared.

Since graduating from the University of Melbourne with a Doctorate in Chemical Engineering with a focus on Geopolymers in 2001, Dr. Phair has worked on fundamental microstructure characterization of cements as a Research Associate at the National Research Council in Washington, DC,on hydrogen separation membranes at the Commonwealth Scientific and Industrial Research Organisation (CSIRO) in Australia, and on solid-oxide fuel cell fabrication and characterization at the Technical University of Denmark in collaboration with Topsoe Fuel Cell.

Prior to joining Pyreos, John worked at poLight AS, a Norwegian company developing MEMS autofocus lens components using thin-film piezo technology for mobile applications. He has over ten years of experience in optical MEMS, functional thin-film materials preparation/characterization, microelectronics, sensors and actuators with over 20 years in materials science.

Presentation

Topic: Miniaturized Mid-Infrared Sensors for Sensing Everywhere

Pyreos Ltd has developed a series of miniature mid-infrared (λ>2.5µm) detectors to address the growing demand for compact, robust, high-performance and low-cost sensors for IoT applications. (eg. In smart cities, smart buildings, precision agriculture, medical and automotive industries.) By leveraging the semiconductor process line, Pyreos has found a cost-effective and reliable way to manufacture the detectors and integrate them in small surface mount packages utilizing state-of-the art packaging. This presentation will update the latest developments from Pyreos and will demonstrate how by bringing smaller form factors, lower power consumption and more sensitive detectors along with digitization, embedded firmware and edge computing, are enabling a spurt in the growth of gas, flame, gesture and motion sensing for a variety of new applications.

Daniel Goehl

UltraSense Systems, Chief Business Officer

Biography

Mr. Goehl is co-founder and Chief Business Officer of UltraSense Systems. This is his sixth startup company heading sales, biz dev and marketing. Prior to UltraSense, he was one of the first employees at InvenSense in 2004 and was Vice President of Worldwide Sales from 2006 to 2017, growing from pre-revenue to over $400M in revenue. He became General Manager of the Sensor Sales Group after the acquisition by TDK Corporation in 2017.

Mr. Goehl has held senior management positions at start-up companies in semiconductor and wireless technology markets, such as Nazomi Communications, CSI Wireless, Meridian Wireless and Omni Telecommunications. Mr. Goehl has a degree in Economics from the University of Illinois and attended Kansai Gaidai University in Osaka, Japan for International Business and Japanese language studies.

Presentation

Topic: Ultrasound as a Touch User Interface Technology to Bring Surfaces to Life

Ultrasound and has been around for decades; to map the ocean floors (sonar); understand the health of prenatal children (sonogram); measure the flow of liquids (Doppler); and detect gestures and the presence of people in a room or behind a car (Time of Flight – TOF). Ultrasound can penetrate almost any material and any material thickness. It is a function of how much power is applied to the transducer. Never have we seen ultrasound used in such a novel way as a precise touch user interface to replace mechanical buttons, whether sensing through thick metal, glass, plastic, wood, leather, etc. In this presentation, we will explore how ultrasound and UltraSense’ TouchPoint technology can be used to replace mechanical buttons and why certain markets are ready and need to transform rapidly from mechanical to seamless virtual buttons.

Peng Qiu / 邱鹏

Vtrantech, Director of Operations / 营运总监

Biography

Master of Shanghai Jiaotong University，Nearly 20 years of semiconductor experience

上海交通大学硕士，近20年半导体工作经验

万虹，博士，微传智能科技（常州）有限公司董事长兼总经理。江苏中科院智能科学技术应用研究院研发中心主任。

1988年获得北京大学物理学博士学位，1989年到美国从事科研工作，先后在加州大学（UCSD）和特拉华大学做博士后。1995年至2009年在美国Honeywell公司任职，历任高级工程师、总工程师和资深技术经理等职务。2009-2012年在美国mCube公司任资深新技术产品总监。万虹博士具有二十多年工业界产品研发、制造和应用经验，涉及工业、汽车和消费电子等领域,拥有60多个国际专利和研发了全球首发的单芯片多轴AMR传感器和单芯片AMR-CMOS集成传感器，是世界级知名磁传感器专家和MEMS运动传感器融合与应用专家。

2012年回国创业，是上海矽睿科技公司的核心创始人.历任副总经理，首席技术官。

2017年1月 – 至今，创建微传智能科技（常州）有限公司并担任总经理/董事长。公司以磁与MEMS运动传感器为核心，为新能源汽车，物联网和工业应用研发、生产及销售高附加值的智能传感器产品。

Manuel Tagliavini

Omdia, Principal Analyst – MEMS & Sensors

Biography

Manuel Tagliaviniis a principal analyst responsible for MEMS and Sensors research activity at IHS Markit (now part of Informa Tech) for all the industrysegments.In addition to supporting the overall activities of the MEMS and sensors group, his responsibilities include the development of forecast modelsfor more than 20 types of silicon-based sensors. As part of his duties he has supported organizations with custom studies, e.g. future scenarios for environmentalsensors or analyzing the mobile marketsupply chain. Prior to his work as an analyst, Manuelspent over 12years with STMicroelectronics working in variousroles and organizations including R&D, product engineering, program management, marketing and business development and finance in the company’s MEMSand sensorsdivision. Manuel earned an Executive Master of Business Administration at SDA Bocconi School of Management, and his Master’s of Science in Electronic Engineering from the University of Parma, both in Italy.He speaks English and Italian.

Presentation

Topic: MEMS & Sensors: looking for the next growth opportunities in the smartphone market and beyond

Sensors are found today in a wide range of end applications, spreading from Consumer Electronics & Mobile to Industrial and Automotive, resulting in a sensor market in a good health overall. Even if sensor adoption in Consumer and Mobile applications can quickly skyrocket and then fade, the market is still growing and often reshaping and renewing itself. While smartphones still represent a huge market, commoditization has left it saturated in value terms and growth is still relevant with the proliferation of multiple image sensors and at the same time it has recently moved to other accessories like smart watches or wireless earbuds from leading suppliers like Apple. Other mainstays like Automotive and Industry on the other hand are subject to longer term trends like electrification and robotization of the car, as well as Industry 4.0, big data and condition monitoring. The presentation looks at the impacts of the major market changes on MEMS and other silicon sensors

Author: Dr. Daquan Yu (left), Presenter: Kai Xue (right)

Author: Dr. Daquan Yu

CEO, Xiamen Sky Semiconductor Technology

Biography

Dr. Daquan Yu is a Distinguished Professor of Xiamen University and the CEO of Xiamen Sky Semiconductor Co., Ltd. He was the President of Research Academy of Advanced Packaging Technology of TSHT Group from 2014 to 2019. He was a professor of Institute of Microelectronics, Chinese Academy of Sciences from 2010 to 2015. He had carried out research work at Fraunhofer IZM in Germany, and Institute of Microelectronics in Singapore from 2005 to 2010. He has authored or co-authored more than 160 peer-reviewed technical publications. He holds more than 40 patents. He is an IEEE senior member since 2013.

厦门云天半导体科技有限公司

于大全，首席执行官

于大全，博士，厦门大学特聘教授、微电子与集成电路系主任，厦门云天半导体创始人。2014-2019年任天水华天科技公司封装技术研究院院长。2010-2015年担任中科院微电子所研究员。2004-2010年先后在香港城市大学、德国Fraunhofer IZM、新加坡微电子所等知名研究机构开展研究。长期从事先进微电子封装技术研究与产业化，发表学术论文200余篇，授权国家发明专利70多项。主要社会任职有：国家科技重大专项02专项总体组特聘专家，中国半导体行业协会MEMS分会副理事长，IEEE高级会员。

Presenter: Kai Xue

Xiamen Sky Semiconductor Technology

Biography

My education and work experience include:

2005-2009, B.S., UESTC
2017-now, Engineering Doctor, UESTC

HHNEC, Senior RF process integration engineer
NCAP, PIE Department, Process Manager
Gmax microelectronics, CEO

薛恺
厦门云天半导体科技有限公司

HHNEC, 资深射频工艺集成工程师
华进半导体，工艺集成部工艺主管
吉迈微电子，总经理

Presentation

Topic: Progress of Advanced Wafer Packaging Technology for MEMS and Sensors

Advanced wafer-level packaging technology is promising not only ICs, but also MEMS and sensors to meet continuing miniaturization of device and system integration for the fast growth of Intelligent Mobile Terminal, IoT, and wearable device. In this talk, advanced wafer packaging technology for RF filters, pressure sensor, bio microfluidic are discussed. The key technologies using 3D film sealing, through glass vias (TGVs) are presented.

Xueyong Wei

Xi’an Jiaotong University, Professor

Biography

Xueyong Wei received his M.S. degree in Xi’an Jiaotong University in 2005 and his Ph.D. degree in University of Birmingham in 2009. He spent two years on research of micromechanical inertial sensors in the University of Cambridge as a post-doctoral research associate. He joined the faculty of the Mechanical Engineering Department at the Xi’an Jiaotong University in 2012 where he is presently a Professor in Microsystems Technology. His research interests include micromechanical resonators and oscillators, MEMS sensors, and Microfluidics. He has published more than 100 peer-reviewed papers and has delivered over 20 invited talks.

Professor Wei is Senior Member of IEEE, Youth Committee Member of both China Instrument and Control Society (CIS) and Chinese Society of Micro/Nano Technology (CSMNT). Professor Wei won the FK Bannister Prize of University of Birmingham (2009) and Young Scientist Award of Microsystem and Nanoengineering Summit (2017). He serves as the Section Executive Editor-in-Chief of Engineering, an international journal that was launched by the Chinese Academy of Engineering in 2015. He has also served as session chair, organization chair of many home and international conferences.

Presentation

Topic: Exploring nonlinear phenomena in micromechanical resonatorsfor advanced sensing applications

Mark Wang

GMEMS Technologies, CEO

Biography

Dr. Mark Wang is the co-founder and CEO of GMEMS Technologies. Inc.

Prior to that, Dr. Wang co-founded NeoMEMS Technologies, Inc. and General MEMS Corporation, both companies were pioneers in MEMS microphone industry and successfully led to high volume productions.
Prior to his venture endeavor, Dr. Wang had worked as senior engineering manager at KLA Tencor. And Dr. Wang was also Vice President of Engineering at Fortemedia Inc. As a veteran in the MEMS industry,

Dr. Wang has more than 40 patents on MEMS sensors, covering a wide range of industries such as consumer electronics, biomedicine, Immunol detection, etc.

王云龙博士是通用微科技有限公司的创办人及总裁。王博士历任 KLA-Tencor（科磊半导体）高级工程经理、富迪科技公司副总裁、美国通用微机电系统有限公司创办人兼总裁。王博士拥有四十多项 MEMS传感器方面的专利，涉及消费电子、生物医学、免疫检测等方面。
王博士在 MEMS传感器研发和产业化方面有成功经验，他和斯坦福大学 Khuri-Yakub教授共同创立了美国通用微机电有限公司，在 2006年就实现了 MEMS硅基麦克风传感芯片的量产。随后王云龙博士在 2010年创办了无锡芯奥微传感技术有限公司并任公司总经理。
2016年，王云龙博士创办了通用微科技有限公司。王云龙博士毕业于美国密西西比大学物理声学专业，是美国声学协会会员，曾任美国网络工程师协会理事、硅谷无线电协会理事。
王云龙博士目前是上海市外国专家局认定的 A类外国专家。

Presentation

Topic: Vibration Resistant MEMS Microphone：A New Breakthrough for Voice Sensing / 减振硅麦 – 语音传感新突破

People usually believe high SNR microphone brings better performance. In real applications, however, a static high SNR measured in the anechoic chamber does not necessarily translate to better device performance. Thus the idea of dynamic SNR is proposed, and the device is invented.

Chiung Lee

Amkor Technology Taiwan, Deputy Director, Strategic Marketing

Biography

Chiung Lee joined Amkor in 2015 and is currently Deputy Director, responsible for Amkor’s MEMS and Sensor products in Greater China region. He previously served as Technical Marketing Manager at STMicro in charge of MEMS and Sensor products. Prior to that, he was a Sr. Engineer developing various MEMS products at ITRI Taiwan for 8 years. He holds a master’s degree in Mechanical Engineering from the National Taiwan University.

Presentation

Topic: Extending the MEMS and Sensor Platform to New Optical Sensors for Emerging Applications

The standardization of package platforms for consumer MEMS and Sensor have evolved quickly over the past several years. Amkor is extending available solutions from Motions and Environmental Sensors to 3D and Image Sensors. As technology advances and emerging applications like sensing and mapping the “Real World”, Human Interface and Authentication become more critical to society, we will increasingly rely on developments in optical sensors to enhance reliable and fast sensing applications for the future.

Optical sensors convert various wavelengths into electrical signals for enhanced sensing applications. Ambient, infrared (IR) and ultraviolet (UV) light are some wave types that optical sensors measure to create applications for autonomous cars, in-display fingerprint scanners, secure facial recognition and many others. The combination of multiple sensors and light sources are crucial to creating a reliable and cohesive sensing system. The adoption of many optical sensors is growing as we rely more on technology to sense the outside world for us.

Songsong Zhang / 张嵩松

SITRI, Technical Director, Advanced Acoustic Group / 上海微技术工业研究院, 技术总监，先进声学部

Biography

ZHANG Songsong received his Ph.D. degree from the Department of Electrical and Computer Engineering, National University of Singapore (NUS). During his Ph.D. study, he explored piezoresistive physical sensors and its application for miniaturized clinical needs. From 2014-2019, he was a research scientist in IME, A*STAR. He focused on piezoelectric AlN pMUT and the industrialization. He is now the director of Advanced Acoustic Group (AAG) in SITRI and working on development of AlN process platform as well as its productization.

2014年于新加坡国立大学获博士学位。攻读博士期间独立设计研究其压阻效应和MEMS传感器在医疗领域的应用。2014底加入新加坡科技研究局(A*STAR) 微电子研究院, 参与氮化铝(AlN)压电MEMS超声换能器的研发和产业化推广。于2019年10月加入上海微系统工业研究院，负责压电平台声学器件设计，制造工艺验证和产业化推广。

Presentation

Topic: Open AlN Platform for Productization and R&D Prototyping / 开放性氮化铝薄膜技术平台以及应用拓展

Advanced sensors and actuators are now widely applied in many fields and almost every aspect in our life. The technology innovation requires holistic progression and systematic development at all level. SITRI is devoted in establishing an open R&D platform which serves the versatility of technology incubation n and the productization needs along with market trend. Aluminum nitride (AlN) piezoelectric platform is one of the key building block that enables the transformation of next generation transducer market. After years of dedication in development of AlN platform in SITRI, we position ourselves as a technology facilitator that supports device fabrication, R&D prototyping and business engagement.

先进的传感器和执行器已经广泛应用于生活的各个领域和各个方面。技术创新即需要先进的系统架构也要求各技术层面上的协同发展。SITRI致力于建立一个开放的研发中式平台，投身于尖端技术孵化和多功能性产品定义，从而满足日益增长的市场需求。氮化铝（AlN）压电平台是实现下一代传感器市场转型的关键组成部分之一。经过多年在AlN平台基础建设和技术开发、积累，我们SITRI将发挥多功能平台优势，支持器件代工、原型开发和商业咨询等服务，不断扩大全球范围影响力，助力国内半导体芯片产业链蓬勃发展。

Yan Huang

ASIC Deputy Director and Sales Director, Senodia

Biography

Mr Yan Huang has joined Senodia since 2009, and he has served successively as ASIC Deputy Director and Sales Director, responsible for digital architecture gyroscope, industrial grade algorithm & module development, sales and marketing etc. Mr Yan Huang possesses a master degree from Shan’Xi Institute of Microelectronics.

黄岩先生自2009年起加入深迪半导体（上海）有限公司。先后担任ASIC副总监、销售总监，负责数字架构陀螺仪，工业级算法和模块的开发，市场与销售。黄岩先生拥有西安微电子技术研究所的硕士学位。

Presentation

Topic: New Applications of MEMS IMU / MEMS IMU的新应用

With the wide application of MEMS IMU in consumer and industrial areas, New applications of MEMS IMU have
emerged in smart wear, smart sport, smart home, smart car, smart medical, smart industry,
and smart farming, etc. As one of the suppliers of MEMS IMU, Senodia will share this new applications with you.

随着MEMS IMU在消费领域，工业领域等的深入应用，MEMS IMU
在诸如智能穿戴，智能运动，智能家居，智能车载，智能医疗，智能工业，智能养殖等细分领域涌现了新的应用，
作为MEMS IMU的供应商之一，深迪有机会接触这些新应用并与大家分享。

Fu Bin / 扶彬

Bosch Sensortec GmbH, Head of Marketing and Business Development / 大中国区业务发展和市场总监

Biography

Bin Fu receives the master degree in Applied Psychology from Zhejiang University, China.She is currently based in Shanghai, where she is responsible for the business development and marketing activity in China market of Bosch Sensortec’s MEMS product portfolio. Bin Fuhas more than 15 years of marketing and product management experience in FMCG and Mechanical Electronic industry. Sheis dedicated to enabling MEMS sensor based innovation and industry upgrading for Chinese companies, startups and players in the field of smart phone, wearables,as well as IoT various applications.

扶彬，现任德国罗伯特·博世有限公司传感器事业部 Bosch Sensortec 大中国区业务发展与市场总监，向亚太区总裁汇报。扶女士负责搭建促进业务增长的全球领先的合作伙伴生态链，推动博世传感器解决方案在智能手机、可穿戴、智能家居、健
康运动、物联网、机器人等领域的战略合作、业务拓展和市场推广。
扶女士拥有浙江大学应用心理学硕士学位，同时在快速消费品，机械电子和半导体产品等领域有着市场销售和产品开发逾15 年的管理经验。扶女士致力于推动基于传感器和智能互联的创新发展和产业升级，助力中国的企业、机构及创客利用全球最先进的传感器技术进行创新以打造引领时代的产品。

Presentation

Topic: Enhanced IoT Edge by Smart Sensors / 智能传感器助力IoT边缘智能

As sensors are being deployed into an ever-increasing range of diverse applications, the need for sensors to be small and ultra-low power remains, however many emerging IoT solutions rely on smart sensors, which provide autonomous intelligence for localized decision-making. Let’s takes a closer look at how the evolution of smarter sensors can contribute to this trend – from the perspective of a sensor solution innovator.

随着传感器被运用到越来越多的多样化应用中，传感器小尺寸和超低功耗的需求任然存在, 然而, 许多新兴的物联网解决方案则更依赖于能为本地化决策提供自主智能方案的智能传感器。让我们从传感器解决方案创新者的角度，更深入地了解智能传感器的发展如何促成这一趋势。

Weidong Chen / 陈卫东

RENA Technologies / 瑞耐技术有限公司, Managing Director, Rena China / 总经理瑞耐中国

Biography

2016 – now Rena (Shanghai) Co., Ltd.

2010-2015 Datwyler (Suzhou)

2005 -2009 Uster (Shanghai)

2016 – now 瑞耐（上海）

2010-2015 德特威勒（苏州）

2005 -2009 乌斯特（上海）

Presentation

Topic: Innovative Manufacturing Concepts for High-volume Semiconductor Chemical Wafer Processing

主题：用于高产半导体湿法工艺的创新制造方案

Brief introduction of Rena Technologies, in terms of overview, business segments and wet processing solution for semiconductor and wafering

摘要：瑞耐技术公司的简单介绍涉及概述，业务分支以及在半导体和大晶圆方面的湿法制程解决方案

Babak Taheri

Silvaco, CEO & CTO

Biography

Babak Taheri is the CEO and CTO at Silvaco Inc., a leading provider of TCAD, EDA, and design IP software. He began his career at Silvaco as chief technical officer and executive vice-president of products. Previously, he was the CEO / president of IBT working with investors, private equity firms, and startups on M&A, technology, and business diligence.

While at IBT, he served on advisory boards of MEMS World Summit, Novasentis, AGCM, ALEA labs, Lion Point Capital, and Silver Lake. Prior to IBT, he was the VP & GM of the sensor solutions division at Freescale semiconductor (now NXP).

Babak was the recipient of ”the perfect project award” in 2003 while at Cypress; Twice recipient of the “Diamond Chip Award” in 2013 /14 while at Freescale; recipient of the MEMS & Sensors executive of the year award in 2014, and in 2015 was the recipient of the Distinguished Engineering Alumni Medal from UC. Davis College of Engineering, where he is on the advisory board to the college.

He also held VP/GM roles at Cypress Semiconductors, Invensense (now TDK) and key roles at SRI International and Apple. He received his Ph.D. in biomedical engineering from UC Davis with majors in EECS and Neurosciences, has over 20 published articles and holds 28 issued patents.

Presentation

Topic: Challenges and Opportunities for Global Semiconductor Businesses

In this talk, I will discuss the major trends and challenges facing semiconductor businesses, including dealing with the COVID-19 crisis, what we have learned, and how the new situation affects the market. Different segments including Automotive, IoT, Memory, 5G networks, Security and Displays will be covered.

Dimitrios Damianos

Yole, Technology & Market Analyst, MEMS, Sensors, Photonics & Imaging

Biography

Dimitrios Damianos, PhD joined Yole Développement (Yole) as a Technology and Market Analyst and is working within the Photonics, Sensing & Display division.

Dimitrios is daily working with his team to deliver valuable technology & market reports regarding the imaging industry including photonics & sensors.

After his research on theoretical and experimental quantum optics and laser light generation, Dimitrios pursued a Ph.D. in optical and electrical characterization of dielectric materials on silicon with applications in photovoltaics and image sensors, as well as SOI for microelectronics at Grenoble’s university (France). In addition, Dimitrios holds a MSc degree in Photonics from the University of Patras (Greece). He has also authored and co-authored several scientific papers in international peer-reviewed journals.

Presentation

Topic: MEMS: more sensitive, smarter and ubiquitous.

Over the years, MEMS market growth has been driven by different waves for new use-cases (automotive, consumer, medical …) and technological innovation (sensor fusion, piezoMEMS …). Today, there is clearly a trend to add more intelligence close to the sensor, waiting for a possible computing-in-sensor in the future. This trend started years ago with inertial sensor fusion (a first sort of edge computing) and today, there is clearly a growing need for audio applications, driving a strong demand for MEMS microphones and MEMS speakers, as integrators are adding more and more functionalities such as understanding more commands, offering a wide variety of uses (request info, listening to music, list-making, buying, etc.). This turns into an evolution of the Cloud to the Edge computing, with more data processing close to the MEMS. During this presentation, the MEMS market and technology trends will be discussed with a slight emphasis on audio markets.

Author: Roland Helm (left), Presenter: Thomas Tang (right).

Author: Dr. Roland Helm

Head of PL Sensors, Senior Director, Infineon / 英飞凌

Biography

Dr. Roland Helm joined Infineon in 2003 after working in a technology start-up and in a business consultancy. Since 2006 he is responsible for the Consumer MEMS business. He has been growing the MEMS microphone biz from technical feasibility to significant market share by focusing on customer requirements, partnerships, leading performance MEMS and ASIC designs as well as high volume manufacturing and delivery capability. Now he is extending the Microphone Business to a Consumer Sensor MEMS business with pressure, optical and environment sensing. He is passionate to match new technology to the needs of modern society.

Roland has a Ph. D. from Technical University of Munich where he majored in physics.

Presenter: Thomas Tang / 唐啸

Staff AE / 主任应用工程师, Infineon / 英飞凌

Biography

2018.11~ now, Infineon Technology (China), staff AE
2015.7~2018.10, Bosch Sensortec, FAE
2009.1~2013.7, G.R.A.S. sound & vibration(China), SZ office Manager
2004.7~2008.12, SZ Horn Audio, RD PL

Presentation

Topic: High performance MEMS Microphone advantage at VUI and TWS applications

Acoustic is playing more and more important part in all aspects of our life. VUI application is direct and instinct control to make our life easier, here high performance microphone helps to get a much better user experience with far-field voice pick-up and voice recognition. With high SNR and AOP microphones’ array, ANC function makes TWS earbuds extraordinary and popular.

As a technical leading company, Infineon offer high performance microphone to enhance user experience and changing our life.

Topic：硅麦克风推进VUI和TWS市场

如今数字智能化的推进，除了看，听和说相关的语音技术更多地在各产品中被使用。语音交互已成为产品智能化的一个选项，给生活带来了很多的简便。高性能的硅麦克风帮助实现了更好的语音交互体验和比如TWS耳机的主动降噪效果，推进相关市场的发展。英飞凌致力于成为硅麦克风领域技术领先的带领者。

Charlie Zhi / 职春星

CEO / 首席执行官, MEMSIC / 美新半导体（天津）有限公司

Biography

1、Nearly 23 years of experience in semiconductor process R&D and design management. He has worked in a number of well-known semiconductor companies at home and abroad including Intel, Jazz Semiconductor, SMIC, and XMC. He has held senior technical and operational positions and founded Brite Semiconductor, a leading domestic design service company;

2、The winner of Shanghai “Pujiang Talent” won the “First Prize of Shanghai Science and Technology Progress Award” and “Outstanding Contribution Award of China’s Integrated Circuit Design Industry” ;

3、Graduated with a doctorate degree in electrical engineering from the Oregon Institute of Technology.

1、近23年的半导体制程研发及设计管理经验，曾就职于多家海内外知名半导体企业包括美国英特尔、捷智半导体，中芯国际，及武汉新芯，并担任技术和运营高层职务，创办了国内领先设计服务公司灿芯半导体，现担任美新半导体（天津）有限公司首席执行官。

2、上海“浦江人才”获得者，曾获“上海市科学技术进步一等奖”和“中国集成电路设计产业杰出贡献奖”；

3、毕业于俄勒冈理工研究学院电子工程专业博士学位。

Presentation

Topic: The Advantages of Integrated MEMS to Enable the Internet of Moving Things

1、Accelerometers are the “Common Denominator” in IoMT（Internet of Moving Things）;

2、How Advanced Single-Chip MEMS Sensor Architecture provides a huge boost for Accelerometers;

3、MEMSIC Advancing Technology Leadership in the field of accelerometers and MEMSIC Sensor Component Product Portfolio.

Andrea Onetti

Analog, MEMS and Sensors Group Vice President
MEMS Sensors Division General Manager
STMicroelectronics

Biography

Andrea Onetti is Group Vice President in the Analog, MEMS and Sensors Group and General Manager of ST’s MEMS Sensors Division and has held this position since February 2016.

Onetti joined STMicroelectronics’ R&D Lab in Castelletto, Italy, in 1990, as a designer of mixed-signal audio IC’s and moved into Product Management five years later, in charge of Marketing for Consumer Audio. Under his leadership, his organization became a Product Division and Onetti’s scope was enlarged to include management of planning, operation, and quality of audio products. In 2011, ST created the Audio and Sound Business Unit, targeting the whole audio chain, from detectors (MEMS microphones) to transducers (MEMS speakers), under Onetti’s charge. Most recently, he added responsibility for the Analog and Audio Systems Division, including catalog analog standard products.

Onetti has several patents for analog circuit implementations in the Audio domain. Andrea Onetti was born in Pavia, Italy, in 1965, and graduated with a Degree in Microelectronics from University of Pavia.

Presentation

Topic: MEMS Sensors supporting the mega-trends

MEMS sensors are a fundamental enabler of key strategic trends in the electronic industry, playing a crucial role in the interface between the real and digital worlds. This presentation explores some of the challenges of electronic system developers in three key areas – smart mobility, power and energy management, and IoT & 5G – and highlights how MEMS innovations are helping address them.

Dr. Benjamin Mimoun

Head of Microphone Development, Sonion

Biography

Dr. Benjamin Mimoun is Head of Microphone Development at Sonion, responsible for the development of MEMS microphones and voice pick-up bone conduction sensors supporting both Hearing Health and Advanced Audio + markets. Benjamin joined Sonion in 2013 as product development engineer and is heading Sonion’s microphone department since January 2017. Benjamin holds an MSc degree in applied physics from the National Institute of Applied Sciences, Toulouse, France, and a PhD degree in MEMS technology from the Delft Institute of Technology, Delft, The Netherlands.

Presentation

Topic: Bone conduction voice pick-up sensor: finding your voice in the noise

What if you could implement reliable voice recognition in your application that is not hindered by surrounding noise at all? Even in the most difficult conditions: in a crowded restaurant, on the train or at a music festival.

Sonion’s Voice Pick Up Bone Sensor allows you to do just that! Unlike a regular MEMS microphone, it relies on bone vibration detection to accurately and reliably pick up one’s own voice amongst all other sounds. Like magic.

During the presentation we will go through Sonion’s unique VPU technology features and investigate how this product can allow TWS earbuds differentiation by supporting megatrends in the hearables market and enabling new use cases.

Dr. Xavier Rottenberg

Scientific Director – Group Leader Wave-Based Sensors and Actuators, imec

Biography

Dr. Xavier Rottenberg obtained his MSc degree in Physics Engineering and the DEA in Theoretical Physics from the Université Libre de Bruxelles in 1998 and 1999, respectively. He obtained in 2008 his PhD degree in Electrical Engineering from the KU Leuven. He worked one year at the Royal Meteorological Institute of Belgium in the field of remote sensing from Space. He has been at IMEC Leuven since 2000, where he contributes to research in the field of RF, RF-MEMS, photonics and microsystems modelling/integration. As imec fellow, he currently leads the Wave-based Sensing and Actuation Developments, working among other topics on integrated photonics, flat optics, acoustics, photo-acoustics and M/NEMS. He has (co-)authored over 150 peer reviewed publications, has been granted various patents, was a lecturer or invited speaker at DTIP (‘05), EuroSimE (‘08), ESREF (‘08), ESoA (‘10/‘12/‘14), RF-MEMS summer school (‘13), FETCH 2016, NERF Neurotechnology Symposium (‘16), OpenMinds (‘17), Nanoworkshop at Beijing University (‘18) and co-founded Pulsify Medical in 2019, a young company developing ultrasound imaging patches.

Presentation

Topic: PhoXonic Microsystems

With more than 20 years’ experience, imec has been at the forefront of advanced MEMS and micromachining technologies. This presentation will review key results obtained at imec in the field of human-centric microsystems, from sensors to actuators with specific focus on wave-based acoustic and optical microsystems. These acoustic and optical microsystems allow to revise typical MEMS approaches. The audience will hear about applications ranging from mid-air haptic feedback over LiDAR to bio-medical sensing.

Roland Helm

Head of MEMS Microphone Manufacturing, Infineon

Presentation

Topic: MEMS Microphones: Professional audio quality and health protection

MEMS Microphones are reaching professional audio performance and are protecting from Covid-19 by measuring indoor air quality.

The Infineon Consumer sensor portfolio emulates human senses for feeling, seeing, smelling and hearing.

The hearing sensor microphone market is growing. Voice as a user interface is increasingly used in many voice controlled applications as e. g. smart speakers. Increasing is also the use of wireless headsets as well as the need for better audio while working remotely and doing video conferences.

The microphones not only become smaller and use less power, but also bring much better audio performance to consumer devices, MEMS microphones are getting in the performance range of professional audio.

This is achieved with continuous MEMS technology innovation, Infineon is now manufacturing the third generation of MEMS microphone technology in very high volume.

New audio features like ANC in small form factors, binaural recording or transparent hearing are enabled by those technologies while design-to-cost optimizes cost/performance ratio.

The audio quality is also the base for the CO2-environmental sensor based on the photoacoustic principle (PAS), which is sampling now.

The CO2-to-aerosol correlation helps to measure when to refresh indoor air quality to reduce Covid-19 infection risk.

Summarizing, Infineon brings audio quality to professional range in consumer devices and uses MEMS microphones for protecting health.

Anil Achyuta

Investment Director, TDK Ventures

Biography

Anil Achyuta is an Investment Director and a Founding Member at TDK Ventures, which is a $50M deep-tech corporate venture fund of TDK. Anil is passionate about energy and healthcare sectors as he believes these are the most impactful areas to building a sustainable future – a mission directly in line with TDK Ventures’ goal. At TDK Ventures, Anil has reviewed over 750 start-ups and invested in: 1) Autoflight (an electric vertical take-off and landing / flying car company), 2) Genetesis (a magnetocardiography cardiac diagnostics company where Anil serves as Board Observer), 3) Origin (3-D printing mass manufacturing company), 4) Exo (hand-held 3-D ultrasound imaging company), 5) GenCell (ammonia-to-energy hydrogen fuel cell company). Prior to TDK, Anil held leadership roles at Fortune 500 companies including L’Oréal, Johnson & Johnson, GlaxoSmithKline, and Draper. Anil has a Ph.D. in Chemical Engineering from Northeastern University and has authored over 15 peer-reviewed journal publications and 5 US patents.

Presentation

TDK Ventures is a technology-focused venture fund, investing globally in early-stage startups that leverages fundamental material science to unlock an attractive and sustainable future for the world. TDK Ventures goal is to help every start-up we invest to achieve their full potential for positive world impact. In this presentation, we first focus on explaining who we are, then explain what our investment thesis for our first fund is, and subsequently demonstrate how we make investment decisions through a qualitative example. We hope that entrepreneurs can better prepare on how to approach a corporate venture fund after listening to this presentation.

Ng Kai Fai

Managing Director, Deputy General Manager, AMEC

Biography

Ng Kai Fai is Managing Director, Deputy General Manager, AMEC International based in Singapore. Kai Fai has a combined 25 years of semiconductor experience spanning from R&D through front end process and equipment engineering to OEM management with 3 major semiconductor companies namely Chartered Semiconductor (now GlobalFoundries) from 1993 internship to 2001, KLA-Tencor (now KLA +) up to 2006 and Axcelis Technologies from 2006 to 2011. Kai Fai spent 6 years as President of SEMI Southeast Asia and he was also the President of Schneider Electric Semiconductor BU prior to joining AMEC.

Kai Fai was involved in the start-up of two wafer fabrication plants both in process engineering and equipment hookup at Chartered Semiconductor and was part of a successful process transfer team involved in HP technology to Fab 6 of Chartered.

In KLA Tencor, he oversees the operations in Singapore and Malaysia while he assumed the country manager role at Axcelis for the Southeast Asia region.

Kai Fai holds 3 US Patents in semiconductor process engineering in etch and materials engineering. He is also the author of a 3 technical papers published at Solid State. In addition, he is involved actively in facilitating the development of the semiconductor industry within SEA through his advisory engagement with government bodies such as EDB (Singapore), MIDA (Malaysia) and MOST (Vietnam).

Dr. Koukou Suu

Senior Fellow and General Manager, ULVAC

Biography

Dr. Koukou Suu is Executive Officer and Senior Fellow of ULVAC, Inc., and alsoPresident and CEO of ULVAC Technologies, Inc. since 2019. He was the General Manager of Global Market and Technology Strategy Division from 2014 to 2019. Prior to this, He served as the General Manager of Institute of Semiconductor and Electronics Technologies from 2008 to 2014. At the Institute of Semiconductor and Electronics Technologies, he worked on Ferroelectric MEMS technologies, emerging non-volatile memories, high-K capacitors, LED, power devices, thin-film Li-battery as well as 3D packaging manufacturing technologies.

Presentation

Topic: Thin-film Processing Technologies of Piezoelectric Material for realizing the CMOS-compatible Piezoelectric MEMS (PiezoMEMS) Devices

Piezoelectric PZT thin films have been utilized to fabricate advanced piezoMEMS devices, such as gyro/acceleration sensor, microphone, piezoelectric micro-machined ultrasonic transducer (pMUT) and micro-mirror. These films have become recognized as key enabling
technologies for “Smartphones”, “Wearable devices” and “Autonomous car” which are becoming one of the most important parts of the “Smart infrastructure” of a modern “Smart Society”. Recently, the integration of CMOS and Piezo-MEMS device is demanded to realize next-generation applications for smart society. In this talk, we will report our development results of CMOS-compatible and high endurance (TDDB)/piezoelectric performance PZT thin-film technology using our novel sputtering process.

Sandy Vos

Senoir Director R&D, NXP Semiconductors

Biography

Coming soon…

Adrian Arcedera

SVP MEMS and Sensor Products, Amkor

Biography

Adrian joined Amkor in 1997, and is currently Sr VP for MEMS and sensor products, responsible for the business and platform development for MEMS & sensors packages. He has served in various positions in product and business development and management of Amkor’s chip scale products, including leading the platform development for Amkor’s ChipArray® package. Prior to joining Amkor, Adrian was a materials engineer for Motorola in the Philippines. He holds a degree in chemical engineering from the University of the Philippines.

Presentation

Topic: What it Takes to be a MEMS and Sensor OSAT

IoT, 5G, AI and autonomous driving. These are some of the buzz words in the semiconductor industry that microelectromechanical systems (MEMS) technology and sensors help enable.

Unique wafer fabrication techniques produce silicon (Si)-based MEMS, sensors and actuators that respond to or interact with external or environmental stimuli. This uniqueness creates different assembly packaging and test challenges – such as controlling package stresses while allowing specific environmental stimuli to reach the device.

The initial focus on solving end-market application challenges has created a broad diversity of package form factors for almost every application and end market. As the market continues to grow, the need for new assembly and test solutions becomes more critical. Standard MEMS and sensor platforms have been implemented to support numerous applications while providing customizability on the inside and a standard form factor on the outside to maintain maximum compatibility during packaging assembly, final test and surface mount assembly processes without sacrificing device performance. This webinar will explore the different packages available from an outsourced assembly and test (OSAT) supplier and their advantages for MEMS and sensor products.

Tomas Bauer

VP Sales and Business Development, Silex

Biography

Tomas Bauer has an outstanding record of deploying successful strategies in the sales of complex technical solutions and manufacturing services. He has played an important role in shaping the global foundry business strategy of Silex and has made a significant contribution to the overall growth of the company. Prior to joining Silex, Tomas held positions with Temex and Ericsson Microelectronics.

Presentation

Topic: A New Era of Growth for MEMS Foundry

In Beijing, Silex’s Fab3 has just finished construction to meet the most challenging demand from the industry’s high volume foundry customers and has plenty of capacity to grow the operation and follow the ever increasing demand for large-scale foundry manufacturing of innovative MEMS and sensors.

The MEMS industry is about to enter a new era of scaling and growth. With segmentation of development and mass production into multiple sites, highly innovative MEMS foundry process technologies can be developed while high-volume applications scale to volumes to meet expected market growth under the same foundry umbrella. To build an efficient multi-fab operation, the foundries need to rely on their deep MEMS know-how and experience in process management, including development of tools and protocols to support operational processes for all aspects of taking a breakthrough product from concept to mass production.

Andrea Rusconi

USound, Clerici, CTO

Biography

Andrea Rusconi has 20 years of experience in the MEMS industry being involved in technology R&D, product design, manufacturing engineering and operations, ranging from new technology IP development to mass production. He has experience in research (Fraunhofer Institute), large companies (STMicroelectronics, Maxim Integrated) and start-ups (Sensordynamics, USound). He co-founded USound in 2014 to develop MEMS micro speakers and bring them to the market, he now serves as Managing Director and CTO.

Presentation

Topic: Enabling next generation audio applications with MEMS micro speakers

MEMS technology is an enabler in the microelectronics industry for supporting ever increasing computing power and connectivity with sensors and actuators for interacting with the environment and users; as an example, MEMS microphones are enabling the invention of new devices and user interfaces not possible before. In the same ecosystem and with similar goals USound is developing MEMS micro speakers. The availability of piezo thin films on silicon substrates is one of the enabling technologies that allow for the design of large force, large displacement, linear actuators; the silicon actuator is mounted on a substrate and combined through a pick and place process with an acoustic membrane to generate sound. Compared to standard micro speakers, MEMS speakers are thin, light and reflow solderable, this enables for the next step in digital devices integration and SMT manufacturing. Main topic of the presentation is a fully integrated audio module including mechanics, acoustics and electronics; the approach for integrating heterogenous components is similar to the integration concepts applied to camera modules for smartphones. These technologies are well in line with roadmaps for in-ear headphones, wired or wireless; for wearables like smart glasses; for array arrangement in smart speakers; for array arrangement in 3D sound headphones and more to come in the future.

Verena Vescoli

ams, VP MEMS & Sensors R&D

Biography

Education: Master of Physics at Technical University Graz, PhD in Physics at ETH Zürich
2000 – 2008 Senior Engineer Device R&D, ams AG
2008 – 2015 Product Manager & Program Management for Particle Measurement at AVL List GmbH
2015 Senior Manager Device R&D, ams AG
Since 2016 Senior Vice President of Research & Development, ams AG

Presentation

Topic: Smart sensor solutions for mobile health monitoring

24/7 remote health monitoring for permanent body tracking is the next step to ensure sustainable health care systems. Chronic diseases impose heavy burden and costs on the health industry in many countries. Suitable health procedures, management, and prevention of disease by continuous monitoring through modern technologies can lead to a decrease in health costs and improve people empowerment. Smart sensors are key building blocks in enabling mobile health monitoring devices and contribute to a more health conscious society.

Ross Bundy

Chief Production Officer & Chief Entrepreneur, Cardea

Biography

Chief Production Officer & Chief Entrepreneur
Ross is responsible for new expansions and key projects at Cardea including scaling up the chip production for Cardea and help setting up partnerships. With an MBA from San Diego State University, Ross has held positions in supply chain, operations, and finance from companies such as General Dynamics and UBC Financial Services. Ross brings precision execution and implementation to the company.

Presentation

Topic: The presentation is Opportunities in Biotech and Related Markets, such as COVID-19

Biotech has been using the same methods for decades, meaning that the solutions to problems that have plagued humanity for all of history still elude us. Cardea is building a Tech+Bio infrastructure that brings the power of semiconductor technology to biotech and enabling solutions to problems such as food supply safety, agriculture and environmental monitoring, and so much more. Pandemics like COVID-19 serve as an example of what is now possible in so many different segments of society and how Cardea can help the electronics industry change biotech forever.

Dr. Walter Weigel

VP and CSO of the European Research Institute, Huawei

Biography

Dr. Walter Weigel graduated from the Technische Universität München, Germany, with the Diplom-Degree in electrical engineering in 1984 and with the Ph. D. degree (thesis about pattern recognition applied to speech recognition)in 1990. From 1984 to 1991 he was assistant at the Lehrstuhl für Datenverarbeitung (Institute for Data Processing) at the Technische Universität München.

Dr.Weigel is since 1st April 2015 VP and CSO of the European Research Institute of Huawei in Leuven, Belgium.

He was from September 2006 to July 2011 the Director General of the European Telecommunication Standards Institute ETSI. Between February 1991 and February 2015he held several positions within Siemens AG, including VP of External Cooperations and Head of Standardization in Corporate Technology, VP of the Research&Concepts-department of the Mobile Networks business unit as well as Head of the business segment Video Processing for the semiconductor business unit (today Infineon).

He is a member of the Innovationsdialog of the German Government, of the BDVA (Big Data Value Association) Board of Directors,of the Senate of Acatech (German academy of technical sciences), of the Board of 5GAA(5G Automotive Association), of the IEEE-SABoard of Governors, of the Digital Manufacturing Executive Councilof Digital Europe and of the Advisory Committee of CTIF Global Capsule (CGC) of Aarhus University.

Presentation

Topic: Collaboration and Trends in the MEMS & Sensors Ecosystem

Holger Conrad

Head of MEMS-Production and Development, Arioso Systems

Biography

Holger Conrad studied electrical engineering and electronics in Dresden (Germany) and graduated with two degrees in 2005 and 2007. He has been working on piezoresistive sensors, piezoelectric and electrostatic micro actuators and gained experience in the conception, modeling, optimization as well as technology and material development of MEMS at Fraunhofer IPMS from 2003 till 2020. In 2018, he took over the management of a business unit at IPMS and worked on several projects for all-silicon micro speaker technologies. In 2020, he co-founded Arioso Systems, where he is the responsible head for MEMS-development and fabrication.

Topic: Membrane-less Electrostatic MEMS µSpeakers

The world of audio is always a rapidly changing market and the new trend of wireless, in-ear headphones (known as ‘hearables’) are no exception. Hearables are wireless in-ear devices that can be connected to the internet and used for a variety of web based service and entertainment applications. The development of the technology has created a large market that many leading manufacturers are turning towards as more users are demanding the technology for a variety of uses. Arioso Systems, a spin-off company of the Fraunhofer Institute for Photonic Microsystems IPMS, is bucking the trend by developing a micro in-ear loudspeaker made from 100% silicon MEMS (micro-electromechanical systems) based on Nanoscopic Electrostatic Drive (NED) technology developed by the IPMS as well, to offer a lighter, longer-lasting hearable experience. The membrane less chips are compatible with CMOS manufacturing process and therefore suitable for mass production.

Valentina Baiardo

Microfluidics Business Unit Director, Analog & MEMS Group MEMS Microactuators Division, STMicroelectronics

Biography

After graduating from the University of Genova in 1994 with a Master’s degree in electronics, Valentina Baiardo joined ST as an IC design engineer for printer and wireless applications. In 2005 she moved into an executive role, initially as program manager and later on as business manager in charge of several strategic programs with ST’s key customers. Valentina currently heads ST’s Microfluidics Business Unit and manages ST’s partnerships with leading companies in ink-jet and other fluidics market segments. Having helped pioneer thin-film PZT technology, Valentina is also in charge of developing innovative, custom microfluidics solutions leveraging ST’s MEMS actuation technologies.

Presentation

Topic: MEMS actuators: the best is yet to come

The first decades of the twenty first century have brought many technology innovations that have changed our lives dramatically. Many of these innovations are invisible to the users of end devices such as smartphones, printers, smart glasses etc. MEMS actuators are one technology that has already played a significant role in enabling smaller devices, saving power and enhancing the user experience. ST worked hard since the beginning of this great story around design, technology and manufacturing, focusing on strategic partnerships to make them happened as you see them today. Looking to the future, piezo-based actuation is emerging as a very promising platform to address many different applications to satisfy new needs. The best is yet to come!

Irina Stateikina

Senior Scientist, C2MI (MiQro Innovation Collaborative Centre)

Biography

Irina Stateikina is a senior scientist at C2MI specializing in MEMS fabrication process development and was a first MEMS integration professional in this company creating the base for a team of specialists joining company in recent years. During eight years in her current position she contributed to an exceptional growth of the company’s portfolio. Building on her experience from 12 years of University teaching she still retains link with the academia as an Affiliate Assistance Professor at Concordia University.

Her divers background in education, comprising Master of Engineering in the railroad automated systems as well as Master of Engineering and PhD in Electrical Engineering specializing in semiconductor physics and devices from Concordia University, Montreal, allowed her to implement this knowledge in design and fabrication of MEMS devices, such as optoelectronic waveguide and magnetic bio-sensors during her postdoctoral fellowship at INRS EMT. Her goal is to enable the advance of MEMS manufacturing through unique collaboration C2MI can offer connecting the start-up and well-established companies with the academia and industry in C2MI’s network.

Presentation

Topic: How may we assist you with your innovation? From your challenges to our roadmap

Last year we have illustrated how C2MI enables the companies in our ecosystem to establish a collaboration amongst each other. This time, we would like to present the way our industrial and academic partners help to shape the direction in our company’s internal development. We will talk about internal projects and how our partners and customers involvement enable their success. Finally, we will discuss latest collaborative projects helping us to provide the best service to our partners as well as current and new customers.

Dr. Fumio Kita

Marketing Manager, Patterning Solutions, Merck

Biography

Dr. Fumio Kita is Marketing Manager for the More-than-Moore segment within Merck’s Patterning Solutions business and is responsible for lithographic materials.

He joined Merck through the acquisition of AZ Electronic Materials where he was Global Marketing Director for Lighting, Energy and Barrier products. During his career, he was responsible for New Business Development of optical films, head of Quality Systems of the German entity and in charge of the Active Ingredients business for lithographic products. Dr. Kita received a doctoral degree and a diploma in Organic Chemistry from the University of Wuerzburg and has an EMBA degree from the Kellogg School of Management.

Presentation

Topic: Advanced Materials And Solutions Which Enable The Manufacturing of High-Tech MEMS Devices

The evolution of chip design is drivingthe technological advancements that we are enjoying in our daily modern society. Thereby, improved materials and processes play a pivotal role in achieving those device-specific technology roadmaps.Through showcase studies, this talkwill provide insights intostate-of-the art semiconductor processing materials for representative MEMS devices alongside with novelties inthe field of packaging/assembling.

Dr. Antti Vasara

President & CEO, VTT

Biography

Dr. Antti Vasara is the President & CEO of VTT Ltd since 2015. VTT is a visionary research, development and innovation partner with over 2000 people and turnover exceeding 250 MEUR. He is president of EARTO (European Association of Research and Technology Organisations) and chairman of the board of Palta (Finnish Service Sector Employers). In addition, he is a non-executive director of Elisa Oyj (largest communications operator in Finland) and a board member at EK (Finnish Confederation of Industries). He has served on several high-level groups on industrial and innovation policy of the European Commission in addition to several groups in Finland on artificial intelligence and research policy. Previously, he has worked in the private industry for close to 25 years at Nokia, Tieto, SmartTrust and McKinsey & Company. Earlier in his career, he was a researcher in optical communications with 20+ peer reviewed articles and one international patent. Dr. Vasara holds a Doctor of Science (Technology) degree from Aalto University in Finland.

Presentation

Topic: New MEMS, New Vision, New Solutions

In difficult times where everything seems to get worse, where we face global challenges, like Covid-19, we can still count on the abundance of resources and creative ideas. Together we develop exponential solutions to lead healthier lives and keep stress levels in check.

The talk will give a glimpse into a few opportunities among many, empowered by hyperspectral imaging and new RADAR architectures and applications.

Luca Verre

Co-founder and CEO, Prophesee

Biography

Luca Verre is Co-Founder and CEO of Prophesee, the inventor of the world’s most advanced neuromorphic vision systems. Prophesee’s patented technology is inspired by human vision, giving sight back to the blind and unleashing new safety standards and autonomy to cars, robots and mobile devices.

Luca is a World Economic Forum Technology Pioneer. He has extensive international management experience in the industrial and electronics sectors. His experience includes project and product management, marketing and business development roles at Schneider Electric. Prior to Schneider Electric, Luca worked as a Research Assistant in Photonics at the Imperial College of London. Luca holds a MSc in Physics, Electronic and Industrial Engineering from Politecnico di Milano and Ecole Centrale and an MBA from INSEAD.

Presentation

Topic: Revealing the invisible to machines with neuromorphic vision systems: Technology and applications overview.

Since their inception 150 years ago, all conventional video tools have represented motion by capturing a number of still frames each second. Displayed rapidly, such images create an illusion of continuous movement. From the flip book to the movie camera, the illusion became more convincing but its basic structure never really changed.

For a computer, this representation of motion is of little use. The camera is blind between each frame, losing information on moving objects. Even when the camera is recording, each of its “snapshot” images contains no information about the motion of elements in the scene. Worse still, within each image, the same irrelevant background objects are repeatedly recorded, generating excessive unhelpful data.

Evolution developed an elegant solution so that natural vision never encounters these problems. It doesn’t take frames. Cells in our eyes report back to the brain when they detect a change in the scene – an event. If nothing changes, the cell doesn’t report anything. The more an object moves, the more our eye and brain sample it.

This is the founding principle behind Event-Based Vision – independent receptors collecting all the essential information, and nothing else.

Prophesee is the inventor of the world’s most advanced neuromorphic vision systems. Composed of patented Metavision® sensors and algorithms, these systems enable machines to see what was invisible to them until now.

With 10-1000x less data generated, >120dB dynamic range and microsecond time resolution (over 10k images per second equivalent), Prophesee Metavision® opens vast new potential in areas such as autonomous vehicles, industrial automation, security and surveillance, mobile, IoT and AR/VR. Its solutions improve safety, reliability efficiency and user experiences across a broad range of use models.

Dr. Ralf Schellin

Vice President, Head of Product Area MEMS, Bosch Sensortec GmbH

Biography

Ralf Schellin received his PhD degree in Electrical Engineering and his Master degree in Technical Physics at the Technical University of Darmstadt, Germany. Currently he is based in Reutlingen, Germany, where he is Head of the Product Area MEMS of Bosch Sensortec. Prior to this, he was Director of Product Management of Bosch Sensortec. From 2010 to 2014 he was leading a cross divisional project at Bosch on Tiny Wireless Sensors for the Internet of Things. From 2007 to 2009 he was leading an engineering group at Bosch Sensortec. Between 2001 and 2006 he held various positions in engineering and product management at Siemens in Munich, Germany, in the area of mobile devices based on IP technologies. Between 1996 and 2000 he was leading various projects in the automotive area of Bosch in Reutlingen working on safety relevant MEMS based sensors. Prior to Bosch he was holding a post-doc position in biosensors at University of Twente, Enschede, The Netherlands.

Presentation

Topic: Smart algorithms, embedded AI and MEMS sensors – the silent enablers of sophisticated daily-life use cases

MEMS sensors are playing a key role as the silent enablers of todays and future consumer electronics applications. With the growing relevance of social trends like safety, health and personalization, the complexity of daily-life use cases is increasing. To tackle the resulting challenges, new approaches are required in the MEMS sensor industry. To continue providing additional value to customers, a stronger focus on hardware-software co-design is required by using advanced algorithms and embedded AI.

In his presentation, Dr. Ralf Schellin, Vice President and Head of Product Area MEMS at Bosch Sensortec, will illustrate the “silent” role of advanced algorithms, MEMS sensors and embedded AI by providing specific use case examples in the context of environmental sensing and self-learning.

Jeffrey Krotosky

CTO, TDK Tronics

Biography

Jeffrey Krotosky serves as CTO and Director of New Product Introduction for Tronics MEMS, a TDK group company, and brings over 15 years of semiconductor and MEMS experience in process development, integration, and design to the company. Jeff is responsible both for the internal development of new sensor technology as well as technology development for the foundry services of Tronics MEMS. Prior to joining Tronics MEMS in 2015, he worked extensively on advanced memory technology with Micron Technology and their joint venture with Intel, IM Flash Technology. Jeff holds an Electrical Engineering degree from the University of Maryland.

Presentation

Topic: Flexible MEMS Sensor Processing and Fabrication

Flexible MEMS sensors offer the ability to measure curves and contours in a world that is not flat. The use of polymers and other flexible materials allows for fabrication of devices and sensors at a cost below traditional silicon based sensors. Polymers and materials for the flexible sensors can also be selected for biocompatibility allowing for the sensor to be used inside and outside the human body. In order to support this emerging technology and market, Tronics MEMS and TDK electronics has designed a processing platform for the creation of biocompatible flexible sensors using traditional MEMS and semiconductor tooling. The processing platform has already been used to create an array of sensors including for temperature, humidity, force, and electrochemical sensing

Dr. Ulrich Peuchert

Global Product Management & Business Development – Special Flat Glass & Wafer, SCHOTT

Biography

Ulrich Peuchert got his Diploma degree on Mineralogy and Material Science from University of Munich, Germany. Ulrich’s received his Phd from University of Cologne on Stuctural and Physical Investigations of Single-Crystalline matters.

Since 1998 Ulrich Peuchert has worked at SCHOTT AG in various functions primarily within Corporate R&D. Ulrich headed various material, product, technology as well as business related development projects and programs. Ulrich’s main focus has been on customer-driven identification and definition of new product opportunities and early-stage promotion to various industries such as energy storage, optics, display and medical. Currently Ulrich is working as Global Senior Product Manager and Business Developer within Strategic Business Field Specialty Flat Glass and Wafer with focus on FLEXINITY® Structured Glass for Semicon & Sensor industries.

Presentation

Topic: Specialty Glass for advanced MEMS Packaging

For many years, SCHOTT specialty thin glass and glass wafers have been an established part of the Camera Sensor & Imaging and MEMS mirror value chains.

Next to the obvious optical properties, non-optical applications such as pressure sensing benefit from superior properties of glass in form of microstructured glass components anodically bonded to Silicon MEMS dies. Optical-, semiconductor- and also (medical) diagnostic sensor industries are relying on glass manufacturers and processors to contribute to future system challenges in terms of performance, cost, reliability, quality/tolerances and lifetime.

Attendees will leave the session with basic knowledge on SCHOTTs contributions to advanced MEMS packaging thanks to ultra-high precision MEMpax® glass wafers as well as FLEXINITY® structured glass. Getting inspired by this, system designers and end-users should be enabled to optimize and develop next-generation sensors along their product roadmaps.

Tom Doyle

Founder and CEO, Aspinity

Biography

Tom Doyle brings over 30 years of experience in operational excellence and executive leadership in analog and mixed-signal semiconductor technology to Aspinity. Prior to Aspinity, Tom was group director of Cadence Design Systems’ analog and mixed-signal IC business unit, where he managed the deployment of the company’s technology to the world’s foremost semiconductor companies. Previously, Tom was founder and president of the analog/mixed-signal software firm, Paragon IC solutions, where he was responsible for all operational facets of the company including sales and marketing, global partners/distributors, and engineering teams in the US and Asia. Tom holds a B.S. in Electrical Engineering from West Virginia University and an MBA from California State University, Long Beach.

Presentation

Topic: Does Always-on Sensing Need to Mean Always-on Everything?

Billions of hands-free always-on sensing devices that run on use terabytes of sensor data every day. And while all that sensed data is naturally analog, the vast majority of these devices digitize all that sensor data before we can determine its relevance –which is massively inefficient. Depending on the application, we might spend 80-90% of the time (and battery power) processing irrelevant data that will simply be thrown away. Aspinity offers an alternative approach that combines the inherent low-power properties of analog with the capabilities of machine learning to determine which data are important up front, right at the beginning of the signal chain, before the data are digitized. The company’s neuromorphic analog chip –Reconfigurable Analog Modular Processor (RAMP) –keeps the analog-to-digital converter (ADC) and higher-power processors asleep until it detects an important event in the raw analog sensor data, enabling a significantly more power-efficient system architecture that can increase battery lifetime by up to 10x.

Jessica Gomez

Founder & CEO, Rogue Valley Microdevices

Biography

As founder and CEO of Rogue Valley Microdevices, Jessica Gomez has created a world-class precision MEMS foundry in the heart of Southern Oregon. Integral to her role as CEO, Ms. Gomez practices a business philosophy of offering best-in-class process technology and R&D expertise to customers, to help them achieve the highest quality and reliability in their products.

Prior to founding Rogue Valley Microdevices in 2003, Ms. Gomez honed her experience in semiconductor processing and production management through positions at Standard Microsystems Corporation, Integrated Micromachines, and Xponent Photonics.

Ms. Gomez plays an active leadership role within and beyond the technology industry. She is a board member of the prestigious SEMI Board of Industry Leaders, and she is the first executive selected for Spotlight on SEMI Women, which honors accomplished women in the global microelectronics industry.

Ms. Gomez is also engaged in STEM and workforce development within the state of Oregon. She is chairman of the Oregon Institute of Technology Board of Trustees, is a board member of Oregon Business Development Commission, is a board member of Center for Women’s Leadership, is a board member of the STEM Investment Council, and is vice chair of the State Workforce Investment Board.

For more information, visit: https://roguevalleymicrodevices.com/

PR Contact: Maria Vetrano, Vetrano Communications, tel: +617.876.2770, Email:

Presentation

Topic: Microelectronics Take Aim at COVID-19

MEMS and microfluidics are ushering in the first major advancements in molecular diagnostics for infectious diseases that we’ve seen in decades. For the past forty years, scientists have been using the molecular genetics technique, polymerase chain reaction (PCR), to detect viruses and bacteria. A more recent refinement, real-time reverse PCR (RT-PCR), is the foundation of most of today’s COVID-19 tests. And while its accuracy is excellent, RT-PCR testing is slow because test samples are sent to the lab for analysis. It also requires expensive, specialized hardware to read results.

Now molecular diagnostics companies are developing MEMS- and microfluidics-based COVID-19 test platforms, leveraging the miniature scale of microelectronics to build handheld devices. Featuring small size and portability, these rapid point-of-care diagnostics deliver results directly at test sites such as clinics, ambulances and triage settings. With built-in real-time cloud connectivity, these new test devices also allow healthcare professionals and public health entities to identify emerging hot spots of infection quickly, so they can allocate medical resources accordingly.

We need technology advancements such as these to help us stem the spread of COVID-19 until a working vaccine is widely available.

Coralie Gallis - Senior Strategic Partnerships North America, CEA

Coralie Gallis graduated as a PhD in Materials Sciences from Paris University and has an engineering degree in Physic-Chemistry. Coralie has worked for 20 years in the semiconductor field, holding various positions in different companies from software designer, Intelligent Specialist, Business Development and Strategic Partnerships. During her career, she developed the business for various domains such as BioMedical electronics, wearable electronics for healthcare, sport, wellness and Food industry. Since 2016, she is based in Silicon Valley, California and manages the Strategic Industrial Partnerships for the North American Market for CEAtech, a French technology research center.

Nicolas Sauvage - Managing Director, TDK Ventures

Nicolas Sauvage is Sr. Director of Ecosystem at TDK-InvenSense, responsible for corporate development and all strategic ecosystem relationships, including Google and Qualcomm, and other HW/SW/System companies. Nicolas was previously part of NXP Software management team, responsible for worldwide sales, and later P&L and product management of the OEM Business Line. Nicolas is an alumnus of Institut supérieur d’électronique et du numérique, London Business School, INSEAD and Stanford.”.

Michelle Bourke - Senior Director of Strategic Marketing (CSBG), Lam Research

Michelle M. Bourke received a B.Sc. degree in Optoelectronics and Laser Engineering from Heriot-Watt University, Edinburgh, Scotland, U.K., in 1993. Subsequently she joined the Defence Evaluation and Research Agency (DERA), where she worked on advanced processing methods for GaAs/AlGaAs optoelectronic devices. In 1997 Michelle moved to the semiconductor capital equipment industry as an etch process engineer. In 1999 she moved into Product Marketing where she has continued to develop her career. Today Michelle is with Lam Research Corporation as the Senior Strategic Marketing Director in the Customer Support Business Group.

Mary Ann Maher - CEO & Founder, SoftMEMS

Dr. Mary Ann Maher received her Ph.D. from Caltech in 1989 in the area of semiconductor device modeling. At Tanner Research she began the simulation and modeling group and launched Tanner’s T-Spice analog circuit simulator product. As Director of Advanced Products, she brought to market Tanner’s MEMS Pro microsystem and MCM Pro multi-chip module and packaging design tool. Moving to MEMSCAP, she became the company’s CTO and the General Manager and Executive Vice President of the Design Automation Business Unit. In 2004, she started SoftMEMS, LLC, the maker of the popular microsystems design tools – MEMS Pro and MEMS Xplorer, where she serves as CEO.

Matthias Schulze - Head of Engineering, Fraunhofer Institute for Photonic Microsystems

Matthias Schulze is Head of Engineering at Fraunhofer Institute for Photonic Microsystems. He has over 10 years of experience in development of MEMS and its monolithic integration on CMOS backplanes. In his position he supervises a team of about 50 engineers, physicists and chemists responsible for single process development and integration in our 200mm CMOS compatible MEMS cleanroom. Prior to joining IPMS he worked several years as a R&D manager in glass and web coating industry (Applied Films, Applied Materials).

Matthias Schulze studied physics at the Technical Universities Dresden and Magdeburg. He got his PhD in 2001 with a work on pulsed magnetron sputtering.

Mike Rosa - Head of Marketing, 200mm Equipment Products Group (EPG), Applied Materials

Mike is currently Head of Marketing for the Equipment Product Group (EPG) within the Applied Global Services division of Applied Materials, Inc., The EPG is composed of New and Refurbished 200mm Semiconductor Equipment, Mask Technology Equipment, and Fab and Environment Solutions (FES) groups. Mike’s team within EPG is responsible for identifying key device level technology inflections and translating those into roadmap requirements for the continued development of equipment and processes in support of More-than-Moore (MTM) device technologies, all market sizing and forecasting activities, and finally marketing and communications for the overall group.

Mike brings over 20 years of technology focused product and business development experience in emerging technology segments. Prior to joining Applied Materials Mike held various contributor level and senior leadership positions within the United States and Australia, working for technology focused companies that include Xerox Corp., PARC Inc., Australian Microelectronics Centre (AMC) and National ICT Australia (NICTA). His technical qualifications include B.Eng (Hons) and Ph.D. degrees in Microelectronics Engineering and MEMS Design / Fabrication, respectively. In addition to his technical qualifications, Mike has an MBA with dual majors in Marketing / Business Strategy and a minor in Entrepreneurship. He has authored over 40 journal and conference publications and holds over 25 U.S. patents.

MWS Europe 2019

Disclaimer

While great efforts were made to ensure accurate and up-to-date information on this website, MEMS World Summit makes no representations or warranties whatsoever, express or implied, as to the content of this website and the products and services described therein, including, without limitation, with respect to accuracy, completeness, non-infringement, merchantability, fitness for a particular purpose, or availability, and MEMS World Summit disclaims any liability for losses or damages of any kind, including losses or damages resulting from the transmission or downloading of computer viruses.

The content of this website may be changed at any time without notice. Links to other websites are provided for the user’s convenience. MEMS World Summit does not express an opinion on the content or the properties of such linked websites and disclaims any liability in connection therewith. The information contained on this website does not constitute an offer for products or services. Investors must not rely on information provided on this website for investment decisions.

MWS EU 2021 Speaker

Würth Elektronik eiSos GmbH & Co. KG

View more of our MWS EU 2021 speakers below

MWS EU 2021 Speakers

Our 2023 Events

Register

Membership

Events

MWS Membership (2023)

VIP Access

Huge Discounts

Exclusive Benefits

Member Joining Fee: $3,000

Join MWS China/EU/SEA (2023)

Physical Event Pass

MWS EU 2023

MWS China 2023

MWS SEA 2023

Virtual Event Pass

Supplier Networker Sponsor