MWS EU 2021 Speaker
Volker Herbig
Volker Herbig, VP BU MEMS at X-FAB, overseas all MEMS activities within the X-FAB Group. Before assuming his current role, Volker worked as Director Product Marketing at X-FAB. Previously he held also engineering, marketing and management positions at Siemens, Inkjet Technologies and Carl Zeiss where, among other activities, he developed MEMS inkjet print heads and was responsible for setting up a manufacturing facility for those. Volker Herbig holds a master’s degree in physics from Humboldt University, Berlin, Germany.
Trends in Wafer Level Integration & Packaging Technologies – Pushing the Envelope of Function, Performance and Efficiency to Enable Advanced System Solutions
Over the past years the semiconductor ecosystem has experienced an ever increasing demand in wafer level integration and packaging technologies, pushing the envelope of functionality, performance and efficiency. In this talk, we will present integration schemes for functional components – ASICs, Sensors and passive devices – and advanced materials, such as glass, polymers, noble metals or compound semiconductors, within a CMOS manufacturing environment. We will outline current technology trends within the MEMS foundry space for heterogonies and monolithic integration, discuss corresponding technology maturity levels while highlighting trade-offs and challenges of both existing and future solutions from an technology and business perspective.
X-FAB
X-FAB MEMS Foundry offers high-volume MEMS manufacturing service and draws on more than 25 years of MEMS manufacturing experience. Operating from five fabs for MEMS and CMOS processes, X-FAB is the proven choice for process development, process capability and long-term manufacturing stability. Along with customer specific process installation, X-FAB offers a range of qualified, in-production, open-platform processes and IP blocks for key MEMS device types.
Alex Gu
Coralie Gallis graduated as a PhD in Materials Sciences from Paris University and has an engineering degree in Physic-Chemistry. Coralie has worked for 20 years in the semiconductor field, holding various positions in different companies from software designer, Intelligent Specialist, Business Development and Strategic Partnerships. During her career, she developed the business for various domains such as BioMedical electronics, wearable electronics for healthcare, sport, wellness and Food industry. Since 2016, she is based in Silicon Valley, California and manages the Strategic Industrial Partnerships for the North American Market for CEAtech, a French technology research center.
Michelle M. Bourke received a B.Sc. degree in Optoelectronics and Laser Engineering from Heriot-Watt University, Edinburgh, Scotland, U.K., in 1993. Subsequently she joined the Defence Evaluation and Research Agency (DERA), where she worked on advanced processing methods for GaAs/AlGaAs optoelectronic devices. In 1997 Michelle moved to the semiconductor capital equipment industry as an etch process engineer. In 1999 she moved into Product Marketing where she has continued to develop her career. Today Michelle is with Lam Research Corporation as the Senior Strategic Marketing Director in the Customer Support Business Group.
Dr. Mary Ann Maher received her Ph.D. from Caltech in 1989 in the area of semiconductor device modeling. At Tanner Research she began the simulation and modeling group and launched Tanner’s T-Spice analog circuit simulator product. As Director of Advanced Products, she brought to market Tanner’s MEMS Pro microsystem and MCM Pro multi-chip module and packaging design tool. Moving to MEMSCAP, she became the company’s CTO and the General Manager and Executive Vice President of the Design Automation Business Unit. In 2004, she started SoftMEMS, LLC, the maker of the popular microsystems design tools – MEMS Pro and MEMS Xplorer, where she serves as CEO.
