Chiung Lee joined Amkor in 2015 and is currently Deputy Director, responsible for Amkor’s MEMS and Sensor products in Greater China region. He previously served as Technical Marketing Manager at STMicro in charge of MEMS and Sensor products. Prior to that, he was a Sr. Engineer developing various MEMS products at ITRI Taiwan for 8 years. He holds a master’s degree in Mechanical Engineering from the National Taiwan University.
You may know us for high-quality semiconductor packaging and test services. But do you know what inspires us to do what we do? An unswerving commitment to customer service, engineering expertise, and high volume manufacturing excellence. Helping solve the complex technological challenges facing the industry is what continually motivates us. We want our customers to focus their resources on semiconductor design and wafer fabrication while trusting us to be their reliable packaging technology innovator and test partner.
Amkor’s operational base includes production facilities, product development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the USA. As the original pioneers of the OSAT industry, Amkor Technology has helped define and advance the technology manufacturing landscape. Since 1968, we’ve delivered innovative packaging solutions with the service and capacity global customers rely on. We’re proud of what we’ve done and can’t wait to show you what’s next.