Co-chair: 古元冬
上海微电子产业学院院长
微机电系统国际峰会咨询委员会主席
Dr. Mustafa Badaroglu is Principal Engineer and Architect at Qualcomm responsible from technology and architecture development for products employing Compute-In-Memory Technology. Before rejoining Qualcomm, he previously worked at Huawei, Qualcomm, IMEC, ON Semiconductor, and Tubitak Space. During his career he had various assignments for the execution and management of mobile, server, and automotive chipset designs from concept to volume production, process technology pathfinding, electronic design automation, and design-technology co-optimization. Dr. Badaroglu received his Ph.D. in Electrical Engineering and holds a Master of Industrial Management, both from the Catholic University of Leuven. He holds more than 60 published patents and (co)-authored over 100 publications in scientific journals/proceedings. He is the global chair of IRDS More Moore Team focusing on HVM roadmap of logic devices and memory. He is a senior member of IEEE.
Qualcomm is the world’s leading wireless technology innovator and the driving force behind the development, launch, and expansion of 5G. When we connected the phone to the internet, the mobile revolution was born. Today, our foundational technologies enable the mobile ecosystem and are found in every 3G, 4G and 5G smartphone. We bring the benefits of mobile to new industries, including automotive, the internet of things, and computing, and are leading the way to a world where everything and everyone can communicate and interact seamlessly.
上海微电子产业学院院长
微机电系统国际峰会咨询委员会主席
EVP MEMS Sensors Sub-Group Analog, MEMS and Sensors Group
STMicroelectronics
研发总监
NXP Semiconductors
Director Sales and Marketing
Afore Oy
Director System Architecture
Bosch Sensortec GmbH
Head of Department Engineering
Fraunhofer Institute for Photonic Microsystems
Division Director MEMS Engineering, Manufacturing & Test
Fraunhofer Institute for Photonic Microsystems
总裁
通用微科技有限公司
研发总监
GoerTek Microelectronics Inc
Strategic Marketing Director
泛林集团
Managing Partner
Lotus Capital
首席硬件架构师
美的集团
CMO & SVP Strategy
Onto Innovation
Director of Marketing Strategy
上海微技术工业研究院
高级副总裁
上海微技术工业研究院
创始人,董事长
苏州希美维纳系统有限公司
首席技术官
SM24
总裁
SoftMEMS
Senior Technology & Market Analyst
Yole Intelligence part of Yole Group
成为会员或注册参加以下具体活动和线上会议
晶圆厂 | 封装测试厂 | 集成电路设计公司 | 终端用户
来自贵公司以下部门的首席管/副总裁/总监级高管免费提供一张2023年所有MWS现场活动的VIP通行证。
所有额外的活动通行证将以较低的会员费率注册。
晶圆厂 | 封装测试厂 | 集成电路设计公司 | 终端用户
Members: $1,050 per person
Non-Members: $2,050 per person
Plus 7.5% service charge
Members: $800 per person
Non-Members: $1,800 per person
Plus 7.5% service charge
Available for purchase soon…
晶圆厂 | 封装测试厂 | 集成电路设计公司 | 终端用户
快来了 2023…
仪器 | 原料 | 电子设计自动化 | 软件供应商
To enquire about sponsorship opportunities, please visit our ISES sponsorship contact form