陆原

瑞士意发薄膜科技有限公司
技术市场总监

简介

陆原博士，Evatec中国区技术市场总监。曾参与Evatec与全球射频滤波器龙头企业的BAW产品研发项目，主导过MEMS央企的战略技术市场工作，包括滤波器，惯性，温度，气体等领域项目合作和投资。目前他的团队负责中国区半导体、光学、光电等事业部的技术解决方案和市场战略制定。

演讲内容

EVATEC – Thin Film Production Solutions for HeterogeneousIntegration

Heterogeneous Integration requires knowledge in functional layers within the dies, along with expertise in Advanced Packaging. Whereas the first part is genuinely core competence of Evatec for piezoelectric sensing or actuating elements, we also have a strong footprint in the AP court. The interdisciplinary approach is of the essence there, for instance in heat dissipation, magnetic shielding, or stress compensation. Mastering the 3rd dimension is also common for both MEMS and AP, where TSVs are elementary.

A variety of deposition technologies such as PVD, PECVD and PEALD on specific tool concepts (batch, single wafer or inline) enables the realization of interesting combinations. This is where Photonics, Optoelectronics, Semiconductors and Advanced Packaging come together – forming today’s MEMS devices.

公司简介

瑞士意发薄膜科技有限公司

Evatec is your partner in thin film deposition platforms and processes across Advanced Packaging, Semiconductor, Optoelectronics and Photonics. Choose from “batch”, “cluster” and “inline” production solutions according to your process, throughput and fab integration requirements using systems capable of handling substrates up to 600x600mm. Within classical MEMS applications our process know how supports the deposition of Piezoelectrics, Magnetics and Photoresistors enabling a new generation of high performance devices whilst complimentary know how in deposition of stress compensation, heat dissipation barrier and other functional layers supports the increasing demand for heterogeneous integration of different functionalities in a chip.