Marco Chen photo
2022 世界微机电系统中国峰会讲师


  • 意发薄膜科技
  • 销售总监
  • 简介


  • 演讲内容
EVATEC – Thin film Production Solutions for Heterogeneous and Monolithic integration

At the heart of today’s MEMS challenges is the Integration of Various Technologies into a device or package. Expertise in one single aspect is no longer good enough. Active piezoelectric sensing or actuating elements meet heat dissipation layers, antireflective coatings, magnetic shielding or stress compensations – all integrated in one device. Supporting manufacturers with a variety of deposition technologies such as PVD, PECVD and PEALD alongside tool concepts (batch, single wafer or inline) enables the realization of specific combinations for the future. This is where Photonics, Optoelectronics, Semiconductors and Advanced Packaging come together – forming today’s MEMS.

  • 公司简介


Evatec is your partner in thin film deposition platforms and processes across Advanced Packaging, Semiconductor, Optoelectronics and Photonics. Choose from “batch”, “cluster” and “inline” production solutions according to your process, throughput and fab integration requirements using systems capable of handling substrates up to 600x600mm. Within classical MEMS applications our process know how supports the deposition of Piezoelectrics, Magnetics and Photoresistors enabling a new generation of high performance devices whilst complimentary know how in deposition of stress compensation, heat dissipation barrier and other functional layers supports the increasing demand for heterogeneous integration of different functionalities in a chip.