
2022 世界微机电系统欧洲峰会讲师
Dr. Mustafa Badaroglu
Dr. Mustafa Badaroglu is Principal Engineer and Architect at Qualcomm responsible from technology and architecture development for products employing Compute-In-Memory Technology. Before rejoining Qualcomm, he previously worked at Huawei, Qualcomm, IMEC, ON Semiconductor, and Tubitak Space. During his career he had various assignments for the execution and management of mobile, server, and automotive chipset designs from concept to volume production, process technology pathfinding, electronic design automation, and design-technology co-optimization. Dr. Badaroglu received his Ph.D. in Electrical Engineering and holds a Master of Industrial Management, both from the Catholic University of Leuven. He holds more than 60 published patents and (co)-authored over 100 publications in scientific journals/proceedings. He is the global chair of IRDS More Moore Team focusing on HVM roadmap of logic devices and memory. He is a senior member of IEEE.
Impact of More Moore scaling for high-performance computing and sensing
There is a growing demand for intelligent edge computing. Advanced logic technologies brings energy-efficient computing while 3D integration provides the necessary infrastructure for heterogenous integration of sensing, power management, memory, communications, and computing in a very small form factor. In this talk we will describe the opportunities, challenges, and mitigation paths for the high-performance edge computing and sensing enabled by advanced logic and 3D integration, paving way for more natural human-computer interfaces.

Qualcomm
Qualcomm is the world’s leading wireless technology innovator and the driving force behind the development, launch, and expansion of 5G. When we connected the phone to the internet, the mobile revolution was born. Today, our foundational technologies enable the mobile ecosystem and are found in every 3G, 4G and 5G smartphone. We bring the benefits of mobile to new industries, including automotive, the internet of things, and computing, and are leading the way to a world where everything and everyone can communicate and interact seamlessly.
2022 世界微机电系统欧洲峰会讲师

Dr. Zhu Yao
Deputy Head – Sensors, Actuators & Microsystems Department – Institute of Microelectronics (IME)
A*STAR (Agency for Science, Technology and Research), Singapore

Ari Kuukkala
General Manager
AEM Afore Oy

Pat Walsh
Managing Director
AMEC

Stefan Martens
Senior Director, MEMS and Sensor Products
安靠科技

José Silva
VP of Operations & R&D Amkor Portugal
安靠科技

Gopal Prabhu
Senior Director of Technology Programs
Applied Materials

Tristan Rousselle
Founder & Deputy CEO
Aryballe

Dr. Ando Feyh
MEMS Strategy Management, New Business and M&A
Bosch

Nigel Beddoe
Director Product Marketing Management
Cohu, Inc

Michele Palmieri
VP Micro & Nano Systems Division
CSEM

Lucilla Sioli
Director Artificial Intelligence and Digital Industry
European Commission

Samira Nik
Programme Manager – Quantum Technologies and Electronics
European Innovation Council and SMEs Agency (EC EISMEA)

Maurus Tschirky
Senior Product Marketing Manager
Evatec AG

Dr. Andrea De Luca
CEO & Co-Founder
Flusso

Thomas Zarbock
Division Director - MEMS Engineering, Manufacturing & Test
Fraunhofer IPMS

Dr. Véronique Rochus
Principal Scientist, Multi-Physics Microsystems Developments
Imec

Laurent Remont
VP Sensor Systems
Infineon Technologies AG

John S. McKillop, Ph.D.
Senior Director Sensor Technology
NXP

Dr. Wei Zhao
Strategic Marketing Director
Onto Innovation

Dr. Stephan Marauska
COO
OQMented

Corrado Rocca
R&D Head, Cyber Unit
PIRELLI Tyre

Dr. Mohssen Moridi
Head of Research Division Microsystems
SAL

Dr. Steve Stoffels
首席技术官
Pulsify Medical

Paul Pickering
Managing Director
Silicon Catalyst

Ingolf Leidert
Product Manager Device Testing
SPEKTRA

Farrokh Ayazi
Founder & CEO
StethX Microsystems

Valentina Baiardo
MEMS Sub-Group Director
STMicroelectronics

Andrea Onetti
EVP, MEMS Sub-Group - Analog, MEMS and Sensors Group
STMicroelectronics

Anton Hofmeister
Group VP & General Manager R&D and Strategy for the Analog and MEMS Sub-Groups
STMicroelectronics

Jeffrey Krotosky
CTO & Director of New Product Introduction for TDK-Tronics
TDK

Collin Twanow
Director Technology
Teledyne

Dr. Koukou Suu
Executive Officer and Senior Fellow of ULVAC, Inc / President and CEO of ULVAC Technologies, Inc
ULVAC

Andrea Rusconi
Co-founder & CTO
Usound

Matthew Crowley
President and CEO
Vesper Technologies

朱守经
音频专家,器件负责人
北京小米移动有限软件公司

Dimitrios Damianos
Senior Technology & Market Analyst
Yole Intelligence part of Yole Group