
2022 世界微机电系统欧洲峰会讲师
José Silva
José joined Amkor in July 2017 as part of the NANIUM acquisition and is currently Vice President of Operations & R&D at ATEP. He started his career at Siemens and later held management positions as Quality Director and Operations Director at Infineon, Qimonda and NANIUM. José holds a degree in Electrical Engineering from Universidade do Porto and an MBA from Porto Business School.
Regionalization of MEMS and Sensor Packaging and Test – an OSAT’s Perspective
The European region is at the forefront of MEMS and Sensor technology. New wafer fabs are being built by the market leaders, new development labs and startups are very active in the region to support the growing demands. But assembly and test solutions are lagging behind in the region. MEMS and Sensor Packaging and Test are transitioning from discrete solutions into more complicated multi-sensor/multiple die packages and even into a full System in Package solutions. Increase complexities require advanced packaging and test, as well as a closer collaboration between the different stakeholders in the MEMS and Sensor ecosystem. The ecosystem requires a stable, reliable supply chain that can scale up with the demand.
A change from the global supply chain networks to a regional supply chain network is happening now and close collaboration in the region with government support will help us address new risk/complexities and ensure a successful MEMS and Sensor ecosystem in Europe for many years into the future.

安靠科技
Amkor Technology is one of the world’s largest providers of high-quality semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test and is a strategic manufacturing partner for the world’s leading semiconductor companies, foundries and electronics OEMs.
Amkor’s broad package portfolio offers our customers semiconductor and test solutions to enable 5G, AI, Automotive, Communications, Computing, Consumer, Industrial, IoT and Networking products.
Services include package design and development, wafer probe and package test, wafer bumping and redistribution, package assembly and final test. Engineering services offer best-in-class thermal, electrical and mechanical modeling and characterization as well as design automation. Test engineering services range from test program development to full product characterization of packaged RF, mixed signal, logic and memory devices.
Amkor’s operational base includes production facilities, product development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the US. For more information, visit www.amkor.com.
2022 世界微机电系统欧洲峰会讲师

Dr. Zhu Yao
Deputy Head – Sensors, Actuators & Microsystems Department – Institute of Microelectronics (IME)
A*STAR (Agency for Science, Technology and Research), Singapore

Ari Kuukkala
General Manager
AEM Afore Oy

Pat Walsh
Managing Director
AMEC

Stefan Martens
Senior Director, MEMS and Sensor Products
安靠科技

Gopal Prabhu
Senior Director of Technology Programs
Applied Materials

Tristan Rousselle
Founder & Deputy CEO
Aryballe

Dr. Ando Feyh
MEMS Strategy Management, New Business and M&A
Bosch

Nigel Beddoe
Director Product Marketing Management
Cohu, Inc

Michele Palmieri
VP Micro & Nano Systems Division
CSEM

Lucilla Sioli
Director Artificial Intelligence and Digital Industry
European Commission

Samira Nik
Programme Manager – Quantum Technologies and Electronics
European Innovation Council and SMEs Agency (EC EISMEA)

Maurus Tschirky
Senior Product Marketing Manager
Evatec AG

Dr. Andrea De Luca
CEO & Co-Founder
Flusso

Thomas Zarbock
Division Director - MEMS Engineering, Manufacturing & Test
Fraunhofer IPMS

Dr. Véronique Rochus
Principal Scientist, Multi-Physics Microsystems Developments
Imec

Laurent Remont
VP Sensor Systems
Infineon Technologies AG

John S. McKillop, Ph.D.
Senior Director Sensor Technology
NXP

Dr. Wei Zhao
Strategic Marketing Director
Onto Innovation

Dr. Stephan Marauska
COO
OQMented

Corrado Rocca
R&D Head, Cyber Unit
PIRELLI Tyre

Dr. Mohssen Moridi
Head of Research Division Microsystems
SAL

Dr. Steve Stoffels
首席技术官
Pulsify Medical

Dr. Mustafa Badaroglu
Principal Engineer/Architect (& IRDS More Moore Global Chair)
Qualcomm

Paul Pickering
Managing Director
Silicon Catalyst

Ingolf Leidert
Product Manager Device Testing
SPEKTRA

Farrokh Ayazi
Founder & CEO
StethX Microsystems

Valentina Baiardo
MEMS Sub-Group Director
STMicroelectronics

Andrea Onetti
EVP, MEMS Sub-Group - Analog, MEMS and Sensors Group
STMicroelectronics

Anton Hofmeister
Group VP & General Manager R&D and Strategy for the Analog and MEMS Sub-Groups
STMicroelectronics

Jeffrey Krotosky
CTO & Director of New Product Introduction for TDK-Tronics
TDK

Collin Twanow
Director Technology
Teledyne

Dr. Koukou Suu
Executive Officer and Senior Fellow of ULVAC, Inc / President and CEO of ULVAC Technologies, Inc
ULVAC

Andrea Rusconi
Co-founder & CTO
Usound

Matthew Crowley
President and CEO
Vesper Technologies

朱守经
音频专家,器件负责人
北京小米移动有限软件公司

Dimitrios Damianos
Senior Technology & Market Analyst
Yole Intelligence part of Yole Group