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2022 世界微机电系统欧洲峰会讲师

José Silva

  • 安靠科技
  • VP of Operations & R&D Amkor Portugal
  • 简介

José joined Amkor in July 2017 as part of the NANIUM acquisition and is currently Vice President of Operations & R&D at ATEP. He started his career at Siemens and later held management positions as Quality Director and Operations Director at Infineon, Qimonda and NANIUM. José holds a degree in Electrical Engineering from Universidade do Porto and an MBA from Porto Business School.

  • 演讲内容
Regionalization of MEMS and Sensor Packaging and Test – an OSAT’s Perspective

The European region is at the forefront of MEMS and Sensor technology. New wafer fabs are being built by the market leaders, new development labs and startups are very active in the region to support the growing demands. But assembly and test solutions are lagging behind in the region. MEMS and Sensor Packaging and Test are transitioning from discrete solutions into more complicated multi-sensor/multiple die packages and even into a full System in Package solutions. Increase complexities require advanced packaging and test, as well as a closer collaboration between the different stakeholders in the MEMS and Sensor ecosystem. The ecosystem requires a stable, reliable supply chain that can scale up with the demand.

A change from the global supply chain networks to a regional supply chain network is happening now and close collaboration in the region with government support will help us address new risk/complexities and ensure a successful MEMS and Sensor ecosystem in Europe for many years into the future.

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  • 公司简介


Amkor Technology is one of the world’s largest providers of high-quality semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test and is a strategic manufacturing partner for the world’s leading semiconductor companies, foundries and electronics OEMs.

Amkor’s broad package portfolio offers our customers semiconductor and test solutions to enable 5G, AI, Automotive, Communications, Computing, Consumer, Industrial, IoT and Networking products.

Services include package design and development, wafer probe and package test, wafer bumping and redistribution, package assembly and final test. Engineering services offer best-in-class thermal, electrical and mechanical modeling and characterization as well as design automation. Test engineering services range from test program development to full product characterization of packaged RF, mixed signal, logic and memory devices.

Amkor’s operational base includes production facilities, product development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the US. For more information, visit

2022 世界微机电系统欧洲峰会讲师