Stefan joined Amkor in 2019 and currently serves as a Director for MEMS and Sensor Products. He manages assembly and test services for large volume automotive and consumer MEMS sensors for European customers. Stefan has 15 years of experience in the semiconductor industry and held positions at Infineon and Huawei in Germany, primarily in the field of RF devices and modules prior to joining Amkor. He has been issued 15 patents and holds a MSc in Applied Physics as well as a PhD in Microsystem Engineering from the University of Freiburg, Germany.
Panel Discussion Sponsored by Applied Materials
Abstract coming soon…
Amkor Technology is one of the world’s largest providers of high-quality semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test and is a strategic manufacturing partner for the world’s leading semiconductor companies, foundries and electronics OEMs.
Amkor’s broad package portfolio offers our customers semiconductor and test solutions to enable 5G, AI, Automotive, Communications, Computing, Consumer, Industrial, IoT and Networking products.
Services include package design and development, wafer probe and package test, wafer bumping and redistribution, package assembly and final test. Engineering services offer best-in-class thermal, electrical and mechanical modeling and characterization as well as design automation. Test engineering services range from test program development to full product characterization of packaged RF, mixed signal, logic and memory devices.
Amkor’s operational base includes production facilities, product development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the US. For more information, visit www.amkor.com.
Deputy Head – Sensors, Actuators & Microsystems Department – Institute of Microelectronics (IME)
A*STAR (Agency for Science, Technology and Research), Singapore
AEM Afore Oy
VP of Operations & R&D Amkor Portugal
Senior Director of Technology Programs
Founder & Deputy CEO
MEMS Strategy Management, New Business and M&A
Director Product Marketing Management
VP Micro & Nano Systems Division
Director Artificial Intelligence and Digital Industry
Programme Manager – Quantum Technologies and Electronics
European Innovation Council and SMEs Agency (EC EISMEA)
Senior Product Marketing Manager
CEO & Co-Founder
Division Director - MEMS Engineering, Manufacturing & Test
Principal Scientist, Multi-Physics Microsystems Developments
VP Sensor Systems
Infineon Technologies AG
Senior Director Sensor Technology
Strategic Marketing Director
R&D Head, Cyber Unit
Head of Research Division Microsystems
Principal Engineer/Architect (& IRDS More Moore Global Chair)
Product Manager Device Testing
Founder & CEO
MEMS Sub-Group Director
EVP, MEMS Sub-Group - Analog, MEMS and Sensors Group
Group VP & General Manager R&D and Strategy for the Analog and MEMS Sub-Groups
CTO & Director of New Product Introduction for TDK-Tronics
Executive Officer and Senior Fellow of ULVAC, Inc / President and CEO of ULVAC Technologies, Inc
Co-founder & CTO
President and CEO
Senior Technology & Market Analyst
Yole Intelligence part of Yole Group